Macom readies its silicon photonics platform for 400G
- Macom has announced a laser-integrated photonic integrated circuit (L-PIC) for the 400G-FR4 standard
- The company is also working with GlobalFoundries to use the semiconductor foundry’s 300mm wafer silicon photonics process
Macom has detailed its latest silicon photonics chip to meet the upcoming demand for 400-gigabit interfaces within the data centre.
The chip, a laser-integrated photonic integrated circuit (L-PIC), was unveiled at the OFC show held last month in San Diego. The L-PIC implements the transmitter circuitry for the 400G-FR4 2km interface standard.