Turning to optical I/O to open up computing pinch points

Getting data in and out of chips used for modern computing has become a key challenge for designers.

Hugo Saleh

A chip may talk to a neighbouring device in the same platform or to a chip across the data centre.

The sheer quantity of data and the reaches involved - tens or hundreds of meters - is why the industry is turning to optical for a chip’s input-output (I/O).

It is this technology transition that excites Ayar Labs.

The US start-up showcased its latest TeraPHY optical I/O chiplet operating at 1 terabit-per-second (Tbps) during the OFC virtual conference and exhibition held in June.

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Open Eye MSA offers an alternative to PAM-4 DSPs

A group of companies, led by Macom and Semtech, have launched a multi-source agreement (MSA) to offer an alternative to using a digital signal processor (DSP) in high-speed client-side optical modules. 

The Open Eye MSA is developing a set of specifications for optical modules that use 50-gigabit 4-level pulse-amplitude modulation (PAM-4) signals whereby only analogue clock and data recovery (CDR) circuitry is required at the receiver.  

By using the CDR instead of a PAM-4 DSP, the optical module will consume less power, have lower latency and be less costly to make, says the MSA.

To ensure interoperability, however, module makers using a PAM-4 DSP will need to meet the new MSA specification. 

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Macom readies its silicon photonics platform for 400G

• Macom has announced a laser-integrated photonic integrated circuit (L-PIC) for the 400G-FR4 standard 

• The company is also working with GlobalFoundries to use the semiconductor foundry’s 300mm wafer silicon photonics process 

Vivek Rajgarhia (centre) being interviewed at OFC. Source: Macom.

Macom has detailed its latest silicon photonics chip to meet the upcoming demand for 400-gigabit interfaces within the data centre. 

The chip, a laser-integrated photonic integrated circuit (L-PIC), was unveiled at the OFC show held last month in San Diego. The L-PIC implements the transmitter circuitry for the 400G-FR4 2km interface standard.

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MACOM acquires Mindspeed to boost 100 Gig offerings

MACOM has acquired Mindspeed Technologies for $272 million, gaining two of the company's three divisions: high-performance analogue and communications processors. Intel has gained the third wireless infrastructure division of Mindspeed that includes 3G/ LTE infrastructure ICs and small-cell technology that Mindpseed gained with the acquisition of UK firm, Picochip, in 2012. 

Ray MoroneyThe Mindspeed acquisition increases the serviceable addressible market for MACOM, both geographical - the company will strengthen its presence in Asia Pacific - and by gaining new equipment vendor accounts. It also broadens MACOM's 100 Gigabit physical device portfolio.

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