Macom readies its silicon photonics platform for 400G

• Macom has announced a laser-integrated photonic integrated circuit (L-PIC) for the 400G-FR4 standard 

• The company is also working with GlobalFoundries to use the semiconductor foundry’s 300mm wafer silicon photonics process 

Vivek Rajgarhia (centre) being interviewed at OFC. Source: Macom.

Macom has detailed its latest silicon photonics chip to meet the upcoming demand for 400-gigabit interfaces within the data centre. 

The chip, a laser-integrated photonic integrated circuit (L-PIC), was unveiled at the OFC show held last month in San Diego. The L-PIC implements the transmitter circuitry for the 400G-FR4 2km interface standard.

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