Intel adds multi-channel lasers to its silicon photonics toolbox

Intel has developed an 8-lane parallel-wavelength laser array to tackle the growing challenge of feeding data to integrated circuits (ICs). 

Haisheng Rong

Optical input-output (I/O) promises to solve the challenge of getting data into and out of high-end silicon devices. 

These ICs include Ethernet switch chips and 'XPUs', shorthand for processors (CPUs), graphics processing units (GPUs) and data processor units (DPUs).

The laser array is Intel's latest addition to its library of silicon photonics devices. 

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Marvell plans for CXL's introduction in the data centre

The open interconnect Compute Express Link (CXL) standard promises to change how data centre computing is architected.

CXL enables the rearrangement of processors (CPUs), accelerator chips, and memory within computer servers to boost efficiency.

Thad Omura

"CXL is such an important technology that is in high focus today by all the major cloud hyperscalers and system OEMs," says Thad Omura, vice president of flash marketing at Marvell. 

Semiconductor firm Marvell has strengthened its CXL expertise by acquiring Tanzanite Silicon Solutions. 

Tanzanite was the first company to show two CPUs sharing common memory using a CXL 2.0 controller implemented using a field-programmable gate array (FPGA). 

Marvell intends to use CXL across its portfolio of products.

Terms of the deal for the 40-staff Tanzanite acquisition have not been disclosed. 

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ADVA and II-VI’s coherent partnership

• ADVA and II-VI have jointly developed a 100-gigabit coherent DSP
• Both companies plan to use the 2.0-2.5W, 7nm CMOS Steelerton DSP for a 100 ZR QSFP28 module
• II-VI’s ASIC design team engineered the DSP while ADVA developed the silicon photonics-based optics. 

ADVA and II-VI have joined forces to define a tiny coherent digital signal processor (DSP) that fits inside a QSFP28 optical module.

Christoph Glingener

The Steelerton DSP can send a 100-gigabit dense wavelength-division multiplexing (DWDM) transmission over 80-120km, carrying wireless backhaul and access traffic.

“It is backhaul of broadband, it is backhaul of mobile, and it definitely moves outdoors,” says Christoph Glingener, CTO at ADVA.

The module also serves metro networks with its 300km reach using optical amplification.

II-VI and ADVA now join such established coherent players as Ciena, Huawei, Infinera, Nokia as well as Marvell, NEL, and Acacia, now part of Cisco.

Effect Photonics announced at OFC earlier this year its coherent market entry with its acquisition of the Viasat DSP team. 

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Ayar Labs gets to work with leading AI and HPC vendors

Optical interconnect specialist Ayar Labs has announced that it is working with Nvidia, a leader in artificial intelligence (AI) and machine learning silicon, systems and software.

In February Ayar Labs announced a strategic collaboration with the world’s leading high-performance computing (HPC) firm, Hewlett Packard Enterprise (HPE).

Charles Wuischpard

Both Nvidia and HPE were part of the Series C funding worth $130 million that Ayar Labs secured in April.

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The quiet progress of Network Functions Virtualisation

Network Functions Virtualisation (NFV) is a term less often heard these days.

Yet the technology framework that kickstarted a decade of network transformation by the telecom operators continues to progress.

Bruno Chatras

The working body specifying NFV, the European Telecommunications Standards Institute's (ETSI) Industry Specification Group (ISG) Network Functions Virtualisation (NFV), is working on the latest releases of the architecture.

The releases add AI and machine learning, intent-based management, power savings, and virtual radio access network (VRAN) support.

ETSI is also shortening the time between NFV releases.

“NFV is quite a simple concept but turning the concept into reality in service providers’ networks is challenging,” says Bruno Chatras, ETSI’s ISG NFV Chairman and senior standardisation manager at Orange Innovation. “There are many hidden issues, and the more you deploy NFV solutions, the more issues you find that need to be addressed via standardisation.”

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II-VI’s VCSEL approach for co-packaged optics

Co-packaged optics was a central theme at this year’s OFC show, held in San Diego. But the solutions detailed were primarily using single-mode lasers and fibre.

Vipul Bhatt

The firm II-VI is beating a co-packaged optics path using vertical-cavity surface-emitting lasers (VCSELs) and multi-mode fibre while also pursuing single-mode, silicon photonics-based co-packaged optics.   

For multi-mode, VCSEL-based co-packaging, II-VI is working with IBM, a collaboration that started as part of a U.S. Advanced Research Projects Agency-Energy (ARPA-E) project to promote energy-saving technologies.

II-VI claims there are significant system benefits using VCSEL-based co-packaged optics. The benefits include lower power, cost and latency when compared with pluggable optics.

The two key design decisions that achieved power savings are the elimination of the retimer chip - also known as a direct-drive or linear interface - and the use of VCSELs.

The approach - what II-VI calls shortwave co-packaged optics - integrates the VCSELs, chip and optics in the same package.

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Vodafone's effort to get silicon for telco

This as an exciting time for semiconductors, says Santiago Tenorio, which is why his company, Vodafone, wants to exploit this period to benefit the radio access network (RAN), the most costly part of the wireless network for telecom operators.

The telecom operators want greater choice when buying RAN equipment.

Santiago Tenorio

As Tenorio, a Vodafone Fellow (the company’s first) and its network architecture director, notes, there were more than ten wireless RAN equipment vendors 15 years ago. Now, in some parts of the world, the choice is down to two.

“We were looking for more choice and that is how [the] Open RAN [initiative] started,” says Tenorio. “We are making a lot of progress on that and creating new options.”

But having more equipment suppliers is not all: the choice of silicon inside the equipment is also limited.

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