Silicon photonics book scheduled for early 2016

Daryl Inniss, practice leader, components at Ovum, and I have started work on a book on silicon photonics. The book, to be written during 2015, will be published by Elsevier.

The work will provide an assessment of silicon photonics and its market impact over the next decade. The title will explore key trends and challenges facing the telecom and datacom industries, provide a history of silicon photonics, and detail its importance. The title will also pinpoint those applications that will benefit most from the technology.

Gazettabyte hopes to share some of the insights and information gathered during the writing of the book. And if this book project is of interest, please feel free to contact us. 

Ranovus readies its interfaces for deployment

• Products will be deployed in the first half of 2015
• Ranovus has raised US $24 million in a second funding round
• The start-up is a co-founder of the OpenOptics MSA; Oracle is now also an MSA member.

Ranovus says its interconnect products will be deployed in the first half of 2015. The start-up, which is developing WDM-based interfaces for use in and between data centres, has raised US $24 million in a second stage funding round. The company first raised $11 million in September 2013.

Saeid Aramideh"There is a lot of excitement around technologies being developed for the data centre," says Saeid Aramideh, a Ranovus co-founder and chief marketing and sales officer. He highlights such technologies as switch ICs, software-defined networking (SDN), and components that deliver cost savings and power-consumption reductions. "Definitely, there is a lot of money available if you have the right team and value proposition," says Aramideh. "Not just in Silicon Valley is there interest, but in Canada and the EU."

Click to read more ...

ECOC 2014: Industry reflections on the show

Gazettabyte asked several attendees at the recent ECOC show, held in Cannes, to comment on key developments and trends they noted, as well as the issues they will track in the coming year. 

Daryl Inniss, practice leader, components at market research firm, Ovum

 It took a while to unwrap what happened at ECOC 2014. There was no one defining event or moment that was the highlight of the conference.

The location was certainly beautiful and the weather lovely. Yet I felt the participants were engaged with critical technical and business issues, given how competitive the market has become.

Click to read more ...

Finisar adds silicon photonics to its technology toolkit

• Finisar revealed its in-house silicon photonics design capability at ECOC
• The company also showed its latest ROADM technologies: a dual wavelength-selective switch and a high-resolution optical channel monitor.
• Also shown was an optical amplifier that spans 400km fibre links 

These two complementary technologies [VCSELs and silicon photonics] work well together as we think about the next-generation Ethernet applications.

Rafik Ward

Click to read more ...

OFC 2014 industry reflections - Part 2

Ciena and Ovum comment on the noteworthy developments and trends following the recent OFC 2014 exhibition and conference. 

The high cost of 100 Gigabit Ethernet client modules has been a major disappointment to me as it has slowed adoption

Joe Berthold, Ciena

Click to read more ...

Acacia uses silicon photonics for its 100G coherent CFP

Acacia Communications has revealed the innards of its 100 Gig coherent pluggable module for metro networks. The AC-100 CFP combines a low-power DSP-ASIC with a silicon-photonics-based optics chip. The CFP's reach is 80km to 1,200km, and its power consumption is 24-26W, well within the pluggable's maximum power profile of 32W.

The power consumption of the AC-100 CFP, and its main components, and the target power consumptions of the components needed for a digital CFP2. Source: Gazettabyte

Click to read more ...

X-Celeprint brings printing technology to silicon photonics

X-Celeprint's micro transfer printing technology. Source: X-Celeprint

• X-Celeprint has a printing process that places individual 'chiplets' of III-V material onto silicon 
• The micro transfer printing technique can be used to make silicon photonics circuits
• X-Celeprint will work with silicon photonics companies interested in licensing its technology

Click to read more ...