Acacia looks to co-package its coherent PIC and DSP-ASIC
- Acacia Communications is working to co-package its coherent DSP and its silicon photonics transceiver chip.
- The company is also developing a digital coherent optics module that will support 400 gigabit.
Acacia Communications is working to co-package its coherent DSP and its silicon photonics transceiver chip. The line-side optical transceiver company is working on a digital coherent optics module that will support 400 gigabits.
Acacia announced last November that it was sampling the industry’s first CFP2 Digital Coherent Optics (CFP2-DCO) that supports 100- and 200-gigabit line rates. The CFP2-DCO integrates the DSP and its silicon photonics chip within a CFP2 module, which is half the size of a CFP module, with each chip packaged separately.