Broadcom's first Jericho3 takes on AI's networking challenge

Broadcom’s Jericho silicon has taken an exciting turn.

Oozie Parizer

The Jericho devices are used for edge and core routers.

But the first chip of Broadcom’s next-generation Jericho is aimed at artificial intelligence (AI); another indicator, if one is needed, of AI’s predominance.

Dubbed the Jericho3-AI, the device networks AI accelerator chips that run massive machine-learning workloads.

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Enfabrica’s chip tackles AI supercomputing challenges

• Enfabrica’s accelerated compute fabric chip is designed to scale computing clusters comprising CPUs and specialist accelerator chips.
• The chip uses memory disaggregation and high-bandwidth networking for accelerator-based servers tackling artificial intelligence (AI) tasks.

Rochan Sankar

For over a decade, cloud players have packed their data centres with x86-based CPU servers linked using tiers of Ethernet switches.

“The reason why Ethernet networking has been at the core of the infrastructure is that it is incredibly resilient,” says Rochan Sankar, CEO and co-founder of Enfabrica.

But the rise of AI and machine learning is causing the traditional architecture to change.

What is required is a mix of processors: CPUs and accelerators. Accelerators are specialist processors such as graphics processing units (GPUs), programmable logic (FPGAs), and custom ASICs developed by the hyperscalers.

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Can a think tank tackle telecoms innovation deficit?

The Telecom Ecosystem Group (TEG) will publish shortly its final paper that concludes two years of industry discussion on ways to spur innovation in telecommunications.

The paper, entitled Addressing the Telecom Innovation Deficit, says telcos have lost much of their influence in shaping the technologies on which they depend.

Source: Telecom Ecosystem Group

“They have become ageing monocultures; disruptive innovators have left the industry and innovation is outsourced,” says the report.

The TEG has held three colloquiums and numerous discussion groups soliciting views from experienced individuals across the industry during the two years.

The latest paper names eight authors but many more contributed to the document and its recommendations.

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The various paths to co-packaged optics

Near package optics has emerged as companies have encountered the complexities of co-packaged optics. It should not be viewed as an alternative to co-packaged optics but rather a pragmatic approach for its implementation.

Co-packaged optics will be one of several hot topics at the upcoming OFC show in March.

Placing optics next to silicon is seen as the only way to meet the future input-output (I/O) requirements of ICs such as Ethernet switches and high-end processors.

Brad Booth

For now, pluggable optics do the job of routing traffic between Ethernet switch chips in the data centre. The pluggable modules sit on the switch platform’s front panel at the edge of the printed circuit board (PCB) hosting the switch chip.

But with switch silicon capacity doubling every two years, engineers are being challenged to get data into and out of the chip while ensuring power consumption does not rise.

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