Hybrid integration specialist Kaiam acquires Gemfire
Kaiam Corp. has secured US $16M in C-round funding and completed the acquisition of Gemfire.
"We have a micro-machine technology that allows us to use standard pick-and-place electronic assembly tools, and with our micro-machine, we achieve sub-micron alignment tolerances suitable for single-mode applications"
Byron Trop, Kaiam
With the acquisition, Kaiam gains planar lightwave circuit (PLC) technology and Gemfire's 8-inch wafer fab in Scotland. This is important for the start-up given there are few remaining independent suppliers of PLC technology.
Working with Oplink Communications, Kaiam has also demonstrated recently a 100 Gigabit 10x10 MSA 40km CFP module.
Hybrid integration technology
Kaiam has developed hybrid integration technology that achieves sub-micron alignment yet only requires standard electronic assembly tools.
"With single-mode optics, it is very, very difficult to couple light between components," says Byron Trop, vice president of marketing and sales at Kaiam. "Most of the cost in our industry is associated with aligning components, testing them and making sure everything works."
The company has developed a micro-machine-operated lens that is used to couple optical components. The position of the lens is adjustable such that standard 'pick-and-place' manufacturing equipment with a placement accuracy of 20 microns can be used. "If you set everything [optical components] up in a transceiver with a 20-micron accuracy, nothing would work," says Trop.
Components are added to a silicon breadboard and the micro-machine enables the lens to be moved in three dimensions to achieve sub-micron alignment. "We have the ability to use coarse tools to manipulate the machine, and at the far end of that machine we have a lens that is positioned to sub-micron levels," says Trop. Photo-diodes on a PLC provide the feedback during the active alignment.
Another advantage of the technique is that any movement when soldering the micro-machine in position has little impact on the lens alignment. "Any movement that happens following soldering is dampened over the distance to the lens," says Trop. "Therefore, movement during the soldering process has negligible impact on the lens position."
Kaiam buys its lasers and photo-detector components, while a fab make its micro-machine. Hybrid integration is used to combine the components for its transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) designs, and these are made by contract manufacturers. Kaiam has a strategic partnership with contract manufacturer, Sanmina-SCI.
The company believes that by simplifying alignment, module and systems companies have greater freedom in the channel count designs they can adopt. "Hybrid integration, this micro-alignment of optical components, is no longer a big deal," says Trop. "You can start thinking differently."
"We will also do more custom optical modules where somebody is trying to solve a particular problem; maybe they want 16 or 20 lanes of traffic"
For 100 Gigabit modules, companies have adopted 10x10 Gigabit-per-second (Gbps) and 4x28Gbps designs. The QSFP28 module, for example, has enabled vendors to revert back to four channels because of the difficulties in assembly.
"Our message is not more lanes is better," says Trop. "Rather, what is the application and don't consider yourself limited because the alignment of sub-components is a challenge."
With the Gemfire acquisition, Kaiam has its own PLC technology for multiplexing and de-multiplexing multiple 10Gbps and, in future, 25Gbps lanes. "Our belief is that PLC is the best way to go and allows you to expand into larger lane counts," says Trop.
Gemfire also owned intellectual property in the areas of polymer waveguides and semiconductor optical amplifiers.
Products and roadmap
Kaiam sells 40Gbps QSFP TOSAs and ROSAs for 2km, 10km and 40km reaches. The company is now selling its 40km 10x10 MSA TOSA and ROSA demonstrated at the recent OFC/NFOEC show. Trop says that the 40km 10x10 CFP MSA module is of great interest to Internet exchange operators that want low cost, point-to-point links.
"Low cost, highly efficient optical interconnect is going to be important and it is not all at 40km reaches," says Trop. "Much of it is much shorter distances and we believe we have a technology that will enable that."
The company is looking to apply its technology to next-generation optical modules such as the CFP2, CFP4 and QSFP28. "We will also do more custom optical modules where somebody is trying to solve a particular problem; maybe they want 16 or 20 lanes of traffic," says Trop.
OFC/NFOEC 2013 product round-up - Part 2
Second and final part
- Custom add/drop integrated platform and a dual 1x20 WSS module
- Coherent receiver with integrated variable optical attenuator
- 100/200 Gigabit coherent CFP and 100 Gigabit CFP2 roadmaps
- Mid-board parallel optics - from 150 to over 600 Gigabit.
- 10 Gigabit EPON triplexer
Add/drop platform and wavelength-selective switches
Oclaro announced an add/drop routing platform for next-generation reconfigurable optical add/drop multiplexers (ROADMs). The platform, which supports colourless, directionless, contentionless (CDC) and flexible grid ROADMs, can be tailored to a system vendor's requirements and includes such functions as cross-connect switching, arrayed amplifiers and optical channel monitors.
"If we make the whole thing [add/drop platform], we can integrate in a much better way"
Per Hansen, Oclaro
After working with system vendors on various line card designs, Oclaro realised there are significant benefits to engineering the complete design.
"You end up with a controller controlling other controllers, and boxes that get bolted on top of each other; a fairly unattractive solution," says Per Hansen, vice president of product marketing, optical networks solutions at Oclaro. "If we make the whole thing, we can integrate in a much better way."
The increasingly complex nature of the add/drop card is due to the dynamic features now required. "You have support for CDC and even flexible grid," says Hansen. "You want to have many more features so that you can control it remotely in software."
A consequence of the add/drop's complexity and automation is a need for more amplifiers. "It is a sign that the optics is getting mature; you are integrating more functionality within your equipment and as you do that, you have losses and you need to put amplifiers into your circuits," says Hansen.
Oclaro continues to expand its amplifier component portfolio. At OFC/NFOEC, the company announced dual-chip uncooled pump lasers in the 10-pin butterfly package multi-source agreement (MSA) it announced at ECOC 2012.
"We have two 500mW uncooled pumps in a single package with two fibres, each pump being independently controlled," says Robert Blum, director of product marketing for Oclaro's photonic components unit.
The package occupies half the space and consumes less than half the power compared to two standard discrete thermo-electrically cooled pumps. The dual-chip pump lasers will be available as samples in July 2013.
Oclaro gets requests to design 4- and 8-degree nodes; with four- and eight-degree signifying the number of fibre pairs emanating from a node.
"Depending on what features customers want in terms of amplifiers and optical channel monitors, we can design these all the way down to single-slot cards," says Hansen. Vendors can then upgrade their platforms with enhanced switching and flexibility while using the same form factor card.
Meanwhile, Finisar demonstrated at OFC/NFOEC a module containing two 1x20 liquid-crystal-on-silicon-based wavelength-selective switches (WSSes). The module supports CDC and flexible grid ROADMs. "This two-port module supports the next-generation route-and-select [ROADM] architecture; one [WSS] on the add side and one on the drop side," says Rafik Ward, vice president of marketing at Finisar.
100Gbps line side components
NeoPhotonics has added two products to its 100 Gigabit-per-second (Gbps) coherent transport product line.
The first is an coherent receiver that integrates a variable optical attenuator (VOA). The VOA sits in front of the receiver to screen the dynamic range of the incoming signal. "This is even more important in coherent systems as coherent is different to direct detection in that you do not have to optically filter the channels coming in," says Ferris Lipscomb, vice president of marketing at NeoPhotonics.
"That is the power of photonic integration: you do a new chip with an extra feature and it goes in the same package."
Ferris Lipscomb, NeoPhotonics
In a traditional system, he says, a drop port goes through an arrayed waveguide grating which filters out the other channels. "But with coherent you can tune it like a heterodyne radio," says Lipscomb. "You have a local oscillator that you 'beat' against the signal so that the beat frequency for the channel you are tuned to will be within the bandwidth of the receiver but the beat frequency of the adjacent channel will be outside the bandwidth of the receiver."
It is possible to do colourless ROADM drops where many channels are dropped, and using the local oscillator, the channel of interest is selected. "This means that the power coming in can be more varied than in a traditional case," says Lipscomb, depending on how many other channels are present. Since there can be up to 80 channels falling on the detector, the VOA is needed to control the dynamic range of the signal to protect the receiver.
"Because we use photonic integration to make our integrated coherent receiver, we can put the VOA directly on the chip," says Lipscomb. "That is the power of photonic integration: you do a new chip with an extra feature and it goes in the same package."
The VOA integrated coherent receiver is sampling and will be generally available in the third quarter of 2013.
NeoPhotonics also announced a narrow linewidth tunable laser for coherent systems in a micro integrated tunable laser assembly (micro-ITLA). This is the follow-on, more compact version of the Optical Internetworking Forum's (OIF) ITLA form factor for coherent designs.
While the device is sampling now, Lipscomb points out that is it for next-generation designs such that it is too early for any great demand.
Sumitomo Electric Industries and ClariPhy Communications demonstrated 100Gbps coherent CFP technology at OFC/NFOEC.
ClariPhy has implemented system-on-chip (SoC) analogue-to-digital (ADC) and digital-to-analogue (DAC) converter blocks in 28nm CMOS while Sumitomo has indium phosphide modulator and driver technology as well as an integrated coherent receiver, and an ITLA.
The SoC technology is able to support 100Gbps and 200Gbps using QPSK and 16-QAM formats. The companies say that their collaboration will result in a pluggable CFP module for 100Gbps coherent being available this year.
Market research firm, Ovum, points out that the announcement marks a change in strategy for Sumitomo as it enters the long-distance transmission business.
In another development, Oclaro detailed integrated tunable transmitter and coherent receiver components that promise to enable 100 Gigabit coherent modules in the CFP2 form factor.
The company has combined three functions within the transmitter. It has developed a monolithic tunable laser that does not require an external cavity. "The tunable laser has a high-enough output power that you can tap off a portion of the signal and use it as the local oscillator [for the receiver]," says Blum. Oclaro has also developed a discrete indium-phosphide modulator co-packaged with the laser.
The CFP2 100Gbps coherent pluggable module is likely to have a reach of 80-1,000km, suited to metro and metro regional networks. It will also be used alongside next-generation digital signal processing (DSP) ASICs that will use a more advanced CMOS process resulting in a much lower power consumption .
To be able to meet the 12W power consumption upper limit of the CFP2, the DSP-ASIC will reside on the line card, external to the module. A CFP, however, with its upper power limit of 32W will be able to integrate the DSP-ASIC.
Oclaro expects such an CFP2 module to be available from mid-2014 but there are several hurdles to be overcome.
One is that the next-generation DSP-ASICs will not be available till next year. Another is getting the optics and associated electronics ready. "One challenge is the analogue connector to interface the optics and the DSP," says Blum.
Achieving the CFP2 12W power consumption limit is non-trivial too. "We have data that the transmitter already has a low enough power dissipation," says Blum.
Board-mounted optics
Finisar demonstrated its board-mounted optical assembly (BOA) running at 28Gbps-per-channel. When Finisar first detailed the VCSEL-based parallel optics engine, it operated at 10Gbps.
The mid-board optics, being aimed at linking chassis and board-to-board interconnect, can be used in several configurations: 24 transmit channels, 24 receive channels or as a transceiver - 12 transmit and 12 receive. When operated at full rate, the resulting data rate is 672Gbps (24x28Gbps) simplex.
The BOA is protocol-agnostic operating at several speeds ranging from 10Gbps to 28Gbps. For example 25Gbps supports Ethernet lanes for 100Gbps while 28Gbps is used for Optical Transport Network (OTN) and Fibre Channel. Overall the mid-board optics supports Ethernet, PCI Express, Serial Attached SCSI (SAS), Infiniband, Fibre Channel and proprietary protocols. Finisar has started shipping BOA samples.
Avago detailed samples of higher-speed Atlas optical engine devices based on its 12-channel MicroPod and MiniPod designs. The company has extended the channel speed from 10Gbps to 12.5Gbps and to 14Gbps, giving a total bandwidth of 150Gbps and 168Gbps, respectively.
"There is enough of a market demand for applications up to 12.5Gbps that justifies a separate part number," says Sharon Hall, product line manager for embedded optics at Avago Technologies.
The 12x12.5Gbps optical engines can be used for 100GBASE-SR10 (10x10Gbps) as well as quad data rate (QDR) Infiniband. The extra capacity supports Optical Transport Network (OTN) with its associated overhead bits for telecom. There are also ASIC designs that require 12.5Gbps interfaces to maximise system bandwidth.
The 12x14Gbps supports the Fourteen Data Rate (FDR) Infiniband standard and addresses system vendors that want yet more bandwidth.
The Atlas optical engines support channel data rates from 1Gbps. The 12x12.5Gbps devices have a reach of 100m while for the 12x14Gbps devices it is 50m.
Hall points out that while there is much interest in 25Gbps channel rates, the total system cost can be expensive due to the immaturity of the ICs: "It is going to take a little bit of time." Offering a 14Gbps-per-channel rate can keep the overall system cost lower while meeting bandwidth requirements, she says.
10 Gig EPON
Operators want to increase the split ratio - the number of end users supported by a passive optical network - to lower the overall cost.
A PON reach of 20km is another important requirement to operators, to make best use of their central offices housing the optical line terminal (OLT) that serves PON subscribers.
To meet both requirements, the 10G-EPON has a PRX40 specification standard which has a sufficiently high optical link budget. Finisar has announced a 10G-EPON OLT triplexer optical sub-assembly (OSA) that can be used within an XFP module among others that meets the PRX40 specification.
The OSA triplexer supports 10Gbps and 1G downstream (to the user) and 1Gbps upstream. The two downstream rates are needed as not all subscribers on a PON will transition to a 10G-EPON optical network unit (ONU).
To meet the standard, a triplexer design typically uses an externally modulated laser. Finisar has met the specification using a less complex directly modulated laser. The result is a 10G-EPON triplexer supporting a split ratio of 1:64 and higher, and that meets the 20km reach requirement.
Finisar will sell the OSA to PON transceiver makers with production starting first quarter, 2014. Up till now the company has used its designs for its own PON transceivers.
See also:
OFC/NFOEC 2013 product round-up - Part 1, click here
OFC/NFOEC 2013 industry reflections - Part 4
Gazettabyte asked industry figures for their views after attending the recent OFC/NFOEC show.
"Spatial domain multiplexing has been a hot topic in R&D labs. However, at this year's OFC we found that incumbent and emerging carriers do not have a near-term need for this technology. Those working on spatial domain multiplexing development should adjust their efforts to align with end-users' needs"
T.J. Xia, Verizon
T.J. Xia, distinguished member of technical staff, Verizon
Software-defined networking (SDN) is an important topic. Looking forward, I expect SDN will involve the transport network so that all layers in the network are controlled by a unified controller to enhance network efficiency and enable application-driven networking.
Spatial domain multiplexing has been a hot topic in R&D labs. However, at this year's OFC we found that incumbent and emerging carriers do not have a near-term need for this technology. Those working on spatial domain multiplexing development should adjust their efforts to align with end-users' needs.
Several things are worthy to watch. Silicon photonics has the potential to drop the cost of optical interfaces dramatically. Low-cost pluggables such as CFP2, CFP4 and QSFP28 will change the cost model of client connections. Also, I expect adaptive, DSP-enabled transmission to enable high spectral efficiencies for all link conditions.
Andrew Schmitt, principal analyst, optical at Infonetics Research
The Cisco CPAK announcement was noteworthy because the amount of attention it generated was wildly out of proportion to the product they presented. They essentially built the CFP2 with slightly better specs.
"It was very disappointing to see how breathless people were about this [CPAK] announcement. When I asked another analyst on a panel if he thought Cisco could out-innovate the entire component industry he said yes, which I think is just ridiculous."
Cisco has successfully exploited the slave labour and capital of the module vendors for over a decade and I don't see why they would suddenly want to be in that business.
The LightWire technology is much better used in other applications than modules, and ultimately the CPAK is most meaningful as a production proof-of-concept. I explored this issue in depth in a research note for clients.
It was very disappointing to see how breathless people were about this announcement. When I asked another analyst on a panel if he thought Cisco could out-innovate the entire component industry he said yes, which I think is just ridiculous.
There were also some indications surrounding CFP2 customers that cast doubt on the near-term adoption of the technology, with suppliers such as Sumitomo Electric deciding to forgo development entirely in favour of CFP4 and/ or QSFP.
I think CFP2 ultimately will be successful outside of enterprise and data centre applications but there is not a near-term catalyst for adoption of this format, particularly now that Cisco has bowed out, at least for now.
SDN is a really big deal for data centres and enterprise networking but its applications in most carrier networks will be constrained to only a few areas relative to multi-layer management.
Within carrier networks, I think SDN is ultimately a catalyst for optical vendors to potentially add value to their systems, and a threat to router vendors as it makes bypass architectures easier to implement.
"Pluggable coherent is going to be just huge at OFC/NFOEC 2014"
Optical companies like ADVA Optical Networking, Ciena and Infinera are pushing the envelope here and the degree to which optical equipment companies are successful is dependent on who their customers are and how hungry these customers are for solutions.
Meanwhile, pluggable coherent is going to be just huge at OFC/NFOEC 2014, followed by QSFP/ CFP4 prototyping and more important production planning and reliability. Everyone is going to use different technologies to get there and it will be interesting to see what works best.
I also think the second half of 2013 will see an increase in deployment of common equipment such as amplifiers and ROADMs.
Magnus Olson, director hardware engineering, Transmode
Two clear trends from the conference, affecting quite different layers of the optical networks, are silicon photonics and SDN.
"If you happen to have an indium phosphide fab, the need for silicon photonics is probably not that urgent. If you don't, now seems very worthwhile to look into silicon photonics"
Silicon photonics, deep down in the physical layer, is now emerging rapidly from basic research to first product realisation. Whereas some module and component companies barely have taken the step from lithium niobate modulators to indium phospide, others have already advanced indium phosphide photonic integrated circuits (PICs) in place.
If you happen to have an indium phosphide fab, the need for silicon photonics is probably not that urgent. If you don't, now seems very worthwhile to look into silicon photonics.
Silicon photonics is a technology that should help take out the cost of optics for 100 Gigabit and beyond, primarily for short distance, data centre applications.
SDN, on the other hand, continues to mature. There is considerable momentum and lively discussion in the research community as well as within the standardisation bodies that could perhaps help SDN to succeed where Generalized Multi-Protocol Label Switching (GMPLS) failed.
Ongoing industry consolidation has reduced the number of companies to meet and discuss issues with to a reasonable number. The larger optical module vendors all have full portfolios and hence the consolidation would likely slow down for awhile. The spirit at the show was quite optimistic, in a very positive, sustainable way.
As for emerging developments, the migration of form factors for 100 Gigabit, from CFP via CFP2 to CFP4 and beyond, is important to monitor and influence from a wavelength-division multiplexing (WDM) vendor point of view.
We should learn from the evolution of the SFP+, originally invented with purely grey data centre applications. Once the form factor is well established and mature, coloured versions start to appear.
If not properly taken into account from the start in the multi-source agreement (MSA) work with respect to, for example, power classes, it is not easy to accommodate tunable dense WDM versions in these form factors. Pluggable optics are crucial for cost as well as flexibility, on both the client side and line side.
Shai Rephaeli, vice president of interconnect products, Mellanox
At OFC, many companies demonstrated 25 Gigabit-per-second (Gbps) prototypes and solutions, both multi mode and single mode.
Thus, a healthy ecosystem for the 100 Gigabit Ethernet (GbE) and EDR (Enhanced Data Rate) InfiniBand looks to be well aligned with our introduction of new NIC (network interface controller)/ HCA (Infiniband host channel adaptor) and switch systems.
However, a significant increase in power consumption compared to current 10Gbps and 14Gbps product is observed. This requires the industry to focus heavily on power optimisation and thermal solutions.
"One development to watch is 1310nm and 1550nm VCSELs"
Standardisation for 25Gbps single mode fibre solutions is a big challenge. All the industry leaders have products at some level of development, but each company is driving its own technology. There may be a real interoperability barrier, considering the different technologies: WDM/ 1310nm, parallel and pulse-amplitude modulation (PAM) which, itself, may have several flavours: 4-levels, 8-levels and 16-levels.
One development to watch is 1310nm and 1550nm VCSELs, which can bring the data centre/ multi-mode fibre volume and prices into the mid-reach market. This technology can be important for the new large-scale data centres, requiring connections significantly longer than 100m.
Part 1: Software-defined networking: A network game-changer, click here
Part 2: OFC/NFOEC 2013 industry reflections, click here
Part 3: OFC/NFOEC 2013 industry reflections, click here
Part 5: OFC/NFEC 2013 industry reflections, click here
OFC/NFOEC 2013 product round-up - Part 1
Part 1: Client-side transceivers
- First CFP2 single-mode and multi-mode transceiver announcements
- Cisco Systems unveils its CPAK module
- 100 Gigabit QSFPs from Kotura and Luxtera
- CFP2 and 40km CFP 10x10 MSA modules
- Infiniband FDR and 'LR4 superset' QSFPs
The recent OFC/NFOEC exhibition and conference held in Anaheim, California, saw a slew of optical transceiver announcements. The first CFP2 client-side products for single-mode and multi-mode fibre were unveiled by several companies, as was Cisco Systems' in-house CPAK transceiver.
The CFP2 is the pluggable form factor that follows the first generation CFP. The CFP MSA announced the completion of the CFP2 specification at the show, while several vendors including Avago Technologies, Finisar, Fujitsu Optical Components, NeoPhotonics, Oclaro and Oplink Communications detailed their first CFP2 products.
The 40 and 100 Gigabit CFP2 is half the size of the CFP, enabling at least a doubling of the CFP2 transceivers on a faceplate compared to four CFPs (see table below). The CFP2 is also future-proofed to support 200 and 400Gbps (See first comment at bottom of CFP2 story).
Another difference between the CFP and the CFP2 is that the CFP2 uses a 4x25Gbps electrical interface. Accordingly, the CFP2 does not need the 'gearbox' IC that translates between ten, 10 Gigabit-per-second (Gbps) lanes to four, 25Gbps electrical lanes that interface to the 4x25/28Gbps optics. Removing the gearbox IC saves space and reduces the power consumption by several watts.
The industry has long settled on the SFP+ at 10Gbps while the QSFP has become the 40Gbps form factor of choice. With 100Gbps still in its infancy, transceiver vendors are pursuing several client-side interfaces. Much work will be needed to reduce the size, power consumption and cost of 100Gbps interfaces before the industry settles on a single pluggable form factor for the single-mode and multi-mode standards.
CFP2 announcements
Finisar demonstrated two CFP2 modules, one implementing the IEEE 100GBASE-LR4 10km standard and the other, the IEEE 100GBASE-SR10 100m multi-mode standard. The company is using directly-modulated, distributed feedback (DFB) lasers for its CFP2 LR4. In contrast, the CFP module uses more expensive, electro-absorption modulator lasers (EMLs). Finisar demonstrated interoperability between the two LR4 modules, an EML-based CFP and a DFB-based CFP2, at the show.
* An ER4 CFP2 is under development
** Oclaro disclosed indium phosphide components for a future CFP2 line side pluggable
Using directly modulated lasers also reduces the power consumption, says Finisar. Overall, the CFP2 LR4 consumes 7W compared to a 24W first-generation CFP-based LR4.
"We can migrate these [directly modulated laser] designs to a single quad 28 Gig photonic integrated circuit TOSA," says Rafik Ward, Finisar's vice president of marketing. "Likewise on the receive [path], there will be a quad 28 Gig ROSA." The TOSA refers to a transmitter optical sub-assembly while the ROSA is the receiver equivalent. Ward says the CFP2s will be in production this year.
Several module and chip makers took part in the Optical Internetworking Forum's (OIF) multi-vendor demonstration of its 4x25 Gigabit chip-to-module electrical interface, the CEI-28G-VSR. The demonstration included CFP2 LR4s from Finisar and from Oclaro as well as Luxtera's 100Gbps shorter reach module in a QSFP28. Oclaro's CFP2 is expected to be in production in the third quarter of 2013.
Another standard implemented in the CFP2 is the 100GBASE-SR10 multi-mode standard. Avago Technologies and Finisar both detailed CFP2 SR10 modules. The SR10 uses 10 VCSELs, each operating at 10Gbps. The SR10 can be used as a 100Gbps interface or as 10 independent 10Gbps channels.
The CFP2 SR10 can be interfaced to 10 Gigabit Ethernet (GbE) SFP+ modules or combinations of 10GbE SFP+ and 40GbE QSFPs. "What people are looking for using the CFP2 multi-mode module is not only for the 100 Gig Ethernet application but interoperability with 40 Gig Ethernet as well as 10 Gig Ethernet modules," says I Hsing Tan, Ethernet segment marketing manager in the fibre optics product division at Avago.
The SR10 electrical interface specification supports retiming and non-retiming options. The Avago CFP2 module includes clock data recovery ICs that can be used for retiming if needed or bypassed. The result is that Avago's CFP2 SR10 consumes 4-6W, depending on whether the clock data recovery chips are bypassed or used.
Meanwhile, NeoPhotonics became the first company to announce the 10x10 MSA in a CFP2.
NeoPhotonics has not detailed the power consumption but says the 10x10Gbps CFP2 is lower than the CFP since all of the chips - photonic and electrical - are a newer generation and much work has gone into reducing the power consumption.
"Demand is quite strong for the 10x10 solution," says Ferris Lipscomb, vice president of marketing at NeoPhotonics. "The CFP2 version is being developed, and we expect strong demand there as well."
The key advantage of the 10x10-based solution over a 4x25Gbps design is cost, according to NeoPhotonics. "10x10 enjoys the volume and maturity of 10 Gig, and thus the cost advantage," says Lipscomb. "We believe the 10x10 CFP2 will follow the trend of the 10x10 MSA CFP and will offer a significant cost advantage over CFP2 LR4-based solutions."
Cisco's CPAK
Cisco finally showed its in-house silicon photonics-based CPAK transceiver at OFC/NFOEC. The CPAK is the first product to be announced following Cisco's acquisition of silicon photonics player, LightWire.
Cisco says the CPAK is more compact than the CFP2 transceiver with the company claiming that 12 or more transceivers will fit on a faceplate. "While the industry is leapfrogging the CFP with the CFP2, our CPAK leapfrogs the CFP2 because it is much more efficient from a size and power consumption perspective," says Sultan Dawood, a marketing manager at Cisco.
Vendors backing the CFP2 stress that the CPAK is only slighter smaller than the MSA module. "The CFP2 and the CPAK are both interim form factors pending when the CFP4 becomes available." says Avago's Tan. "Any product [like the CFP2] governed by an MSA is going to see strong market adoption."
Cisco's CPAK transceiver Source: Cisco
The CFP4 specification is still being worked on but 16 CFP4s will fit on a faceplate and the transceiver is scheduled for the second half of 2014.
At OFC, Cisco demonstrated the CPAK implementing the 100GBASE-LR4 and -SR10 standards. The CPAK transceiver will be generally available in the summer of 2013, says Cisco.
CFP
Oplink Communication and hybrid integration specialist, Kaiam, showed a 100Gbps 10x10 MSA CFP implementing a 40km extended reach.
The 10x10 40km CFP is for connecting data centres and for broadband backhaul applications. The CFP electro-absorption modulator lasers coupled to a wavelength multiplexer make up the TOSA while the ROSA comprises avalanche photodiode receivers and a demultiplexer. Samples will be available in the second quarter of 2013, with production starting in the third quarter.
Source Photonics announced a second-generation 100GBASE-LR4 CFP with a power consumption of 12-14W.
Meanwhile, Effdon Networks detailed its first 100Gbps product, a CFP with a reach of 80km. Until now 100Gbps CFPs have been limited largely to 10km LR4 while the first 100Gbps CFPs with a reach of 80km or greater being 4x25Gbps direct-detection designs that can include specialist ICs.
100 Gig QSFP
Luxtera and Kotura, both detailed 100 Gigabit QSFPs that use their respective silicon photonics technology. The Kotura design uses two chips, has a reach of 2km and is a four-channel wavelength-division multiplexing (WDM) design while the Luxtera design is a four-channel integrated transceiver that uses a single laser and is tailored for 500m although Luxtera says it can achieve a 2km reach.
40 Gigabit Ethernet and Infiniband FDR
Avago Technologies announced that its eSR4 40 Gigabit Ethernet (GbE) QSFP+ has a reach of up to 550m, beyond the reach specified by the IEEE 40GBASE-SR4 standard. The eSR4 supports 40GbE or four independent 10GbE channels. When used as a multi-channel 10GbE interface, the QSFP+ interfaces to various 10GbE form factors such as X2, XFP and SFP+, It can also interface to a 100GbE CFP2, as mentioned.
Avago first announced the eSR4 QSFP+ with a reach of 300m over OM3 multi-mode fibre and 400m over OM4 fibre. The eSR4 now extends the reach to a guaranteed 550m when used with specific OM4 fibre from fibre makers Corning, Commscope and Panduit.
The extended reach is needed to address larger data centres now being build, as well as support flatter switch architectures that use two rather than three tiers of switches, and that have greater traffic flowing between switches on the same tier.
Avago says data centre managers are moving to deploy OM4 fibre. "The end user is going to move from OM3 to OM4 fibre for future-proofing purposes," says Tan. "The next-generation 32 Gig Fibre Channel and 100 Gigabit Ethernet are focussing on OM4 fibre."
Meanwhile, ColorChip showed its 56Gbps QSFP+ implementing the FDR (Fourteen Data Rate) 4x Infiniband standard as part of a Mellanox MetroX long-haul system demonstration at the show.
Finisar also demonstrated a 40Gbps QSFP using four 1310nm VCSELs. The result is a QSFP with a 10km reach that supports a 40Gbps link or four, 10Gbps links when used in a 'breakout' mode. The existing 40GBASE-LR4 standard supports a 40Gbps link only. Finisar's non-standard implementation adds a point-to-multipoint configuration.
"A single form factor port can be used not only for 40 Gig but also can enable higher density 10 Gig applications than what you can do with SFP+," says Ward.
Kaiam detailed a 40Gbps QSFP+ ER4 transceiver having a 40km reach. The QSFP+ transceiver has the equivalent functionality of four DML-based SFP+s fixed on a coarse WDM grid, and includes a wavelength multiplexer and de-multiplexer.
For OFC/NFOEC 2013 - Part 2, click here
Further reading
LightCounting: OFC/NFOEC review: news from the show floor, click here
Ovum: Cisco hits both show hot buttons with silicon photonics for 100G, click here
OFC/NFOEC 2013 industry reflections - Part 2
Bill Gartner, vice president and general manager of high-end routing and optical business unit at Cisco Systems.
There were several key themes during this year’s OFC conference, but what I found most compelling were the disruptive trends and technologies that stand to significantly impact the optical communications market in the coming years.
"SDN could be the single biggest disruptor in the transport industry and has the potential to transform network programmability and orchestration"
One of the hottest themes at this year’s OFC conference is the role of silicon photonics and the benefits it presents to service providers and carriers. Silicon photonics is truly one of the most interesting advancements taking place in the industry as it has the potential to drastically lower the density, power and overall cost of ASICs.
Several carriers at the show, including CenturyLink and AT&T, presented their view that optics is becoming a larger portion of their spend and now exceeds the cost of packet switching technologies.
A second key trend coming out of the show is software-defined networking (SDN) and its impact on networking. There is tremendous industry interest around this topic and it extended to the Anaheim Convention Center.
With SDN, our customers can increase flexibility in terms of selecting the features and protocols that make sense for their network application – whether it is a data centre application, a service provider application or a large-scale enterprise application.
The last theme that resonated during OFC was around the convergence of packet and optical solutions. As service providers look for ways to decrease both CapEx and OpEx related to the network, incremental technology improvements will decrease costs. However, for many customers, their network capacity is growing far faster than their revenues, so incremental improvements will not yield required reductions.
"As an industry we have to evolve organisationally and technically. Those who fail to recognise that face extinction."
This shows us that we need to explore more fundamental shifts in architectures that have the potential to yield significant savings in OpEx and CapEx. Enter the convergence of IP and optical – this may take the form of converged platforms, but will also involve multi-layer control planes that allow the exchange of information between the packet and optical layers. This convergence helps answer questions like: How well is the network utilised? Can it be optimised? Are there multi-layer protection/ restoration schemes that make better use of the available resources?
During the conference, I had the opportunity to present at the OSA Executive Forum, which brought together more than 150 senior-level executives to discuss key themes, opportunities and challenges facing the next generation in optical communications.
What struck me is that this industry is constantly evolving, which presents challenges and opportunities. We are looking at an industry that is highly fragmented at the moment and requires further streamlining.
You have new players at every level of the value chain that bring exciting, unique perspectives and advanced technologies that increase efficiency and decrease costs. But none of this innovation comes without change; as an industry we have to evolve organisationally and technically. Those who fail to recognise that face extinction.
"This is like solving a simultaneous equation where the variables are power, cost and density – you need to solve for all three"
The key themes discussed at OFC are an indication of what is to come in optical transport and mirror our top priorities at Cisco.
In the coming year, we expect to see CMOS photonics technology enable lower power pluggables. This is the case with CPAK, but more broadly, we will see this technology find its way into low cost board-to-board interconnect and chassis-to-chassis interconnect.
As an industry, we have made great progress in reducing the cost of transmitting bits over a long distance but much more remains to be done. As bit rates increase to beyond 100 Gigabit, we must look for ways to drive this cost down faster, while decreasing both power and size. This is like solving a simultaneous equation where the variables are power, cost and density – you need to solve for all three.
During the next five years, I think that SDN could be the single biggest disruptor in the transport industry and has the potential to transform network programmability and orchestration.
We will see an entire software industry emerge around SDN, but it is important to note that this is really all about multilayer control – Layer 0 to Layer 3. SDN is not simply an optical transport problem to be solved. The advantage will go to those who are looking at this holistically.
Brandon Collings, CTO of the communications and commercial optical products group at JDSU
I found it interesting that the major network equipment manufactures had a significantly increased presence on the exhibition floor.
"This year’s focus and buzz was all on silicon photonics with researchers leveraging it against nearly every function in telecom and datacom"
I learned a lot about SDN at levels above the photonic network. This is a very complex topic likely to take some time to fully mature within telecom networks; however, the potential values appear compelling.
This year’s focus and buzz was all on silicon photonics with researchers leveraging it against nearly every function in telecom and datacom. I expect it will be interesting for industry watchers how this promising technology evolves within the industry, where it achieves its promise and where it runs into practical roadblocks.
Vladimir Kozlov, CEO of LightCounting
This was the best OFC since 2000. The optical community is once again energised. Some attribute the improved mood to high-value acquisitions of companies LightWire and Nicira that were made last year, but this is just part of the story.
Yes, the potential of silicon photonics and software-defined networking (which LightWire and Nicira were focussed on, respectively) do broaden the horizon for optical technologies in communication networks and data centres. But the excitement is not limited to just these two ideas. All the new - and old or forgotten - ideas, technologies and products once again have a shot at making a difference. Demand for optics is strong and the customers are hungry for innovation.
"Demand for optics is strong and the customers are hungry for innovation"
In contrast to 2000, few people are getting carried away with the excitement. The mood is much more constructive this time and it makes me hope that most of this new energy will not be wasted.
I would not single out a specific technology or application to watch out for in the next few years. All of them have opportunities and challenges ahead. We will keep track of as many developments as we can and make sure that hype does lead the industry off the tracks this time.
Effie Favreau, marketing, Sumitomo Electric
One hundred Gigabit technology is here. Last year there was a lot of hype about 100 Gigabit and now it is reality; vendors have products that are shipping.
Sumitomo and ClariPhy partnered on pluggable coherent modules. Together, we hosted an impressive demonstration with all the components to make pluggable coherent modules available next year.
"For the enterprise/ data centre, vendors requiring low cost, high density equipment really need the CFP4"
One thing I learned from the show is that vendors need to re-purpose their existing equipment. There was much discussion regarding software-enabled applications and passives to enhance the performance of networks and make them more intelligent.
There was the introduction of the CFP2 from several vendors as well as Cisco's CPAK. For the enterprise/ data centre, vendors requiring low cost, high density equipment really need the CFP4. At Sumitomo, we are concentrating our R&D efforts on the CFP4.
See also:
Part 1: Software-defined networking: A network game-changer? click here
Part 3: OFC/NFOEC 2013 industry reflections, click here
Part 4: OFC/NFOEC industry reflections, click here
Part 5: OFC/NFEC 2013 industry reflections, click here
Luxtera's interconnect strategy
Part 1: Optical interconnect
Luxtera demonstrated a 100 Gigabit QSFP optical module at the OFC/NFOEC 2013 exhibition.
"We're in discussions with a lot of memory vendors, switch vendors and different ASIC providers"
Chris Bergey, Luxtera
The silicon photonics-based QSFP pluggable transceiver was part of the Optical Internetworking Forum's (OIF) multi-vendor demonstration of the 4x25 Gigabit chip-to-module interface, defined by the CEI-28G-VSR Implementation Agreement.
The OIF demonstration involved several optical module and chip companies and included CFP2 modules running the 100GBASE-LR4 10km standard alongside Luxtera's 4x28 Gigabit-per-second (Gbps) silicon photonics-based QSFP28.
Kotura also previewed a 100Gbps QSFP at OFC/NFOEC but its silicon photonics design uses two chips and wavelength-division multiplexing (WDM).
The Luxtera QSFP28 is being aimed at data centre applications and has a 500m reach although Luxtera says up to 2km is possible. The QSFP28 is sampling to initial customers and will be in production next year.
100 Gigabit modules
Current 100GBASE-LR4 client-side interfaces are available in the CFP form factor. OFC/NFOEC 2013 saw the announcement of two smaller pluggable form factors at 100Gbps: the CFP2, the next pluggable on the CFP MSA roadmap, and Cisco Systems' in-house CPAK.
Now silicon photonics player Luxtera is coming to market with a QSFP-based 100 Gigabit interface, more compact than the CFP2 and CPAK.
The QSFP is already available as a 40Gbps interface. The 40Gbps QSFP also supports four independent 10Gbps interfaces. The QSFP form factor, along with the SFP+, are widely used on the front panels of data centre switches.
"The QSFP is an inside-the-data-centre connector while the CFP/CFP2 is an edge of the data centre, and for telecom, an edge router connector," says Chris Bergey, vice president of marketing at Luxtera. "These are different markets in terms of their power consumption and cost."
Bergey says the big 'Web 2.0' data centre operators like the reach and density offered by the 100Gbps QSFP as their data centres are physically large and use flatter, less tiered switch architectures.
"If you are a big systems company and you are betting on your flagship chip, you better have multiple sources"
The content service providers also buy transceivers in large volumes and like that the Luxtera QSFP works over single-mode fibre which is cheaper than multi-mode fibre. "All these factors lead to where we think silicon photonics plays in a big way," says Bergey.
The 100Gbps QSFP must deliver a lower cost-per-bit compared to the 40Gbps QSFP if it is to be adopted widely. Luxtera estimates that the QSFP28 will cost less than US $1,000 and could be as low as $250.
Optical interconnect
Luxtera says its focus is on low-cost, high-density interconnect rather than optical transceivers. "We want to be a chip company," says Bergey.
The company defines optical interconnect as covering active optical cable and transceivers, optical engines used as board-mounted optics placed next to chips, and ASICs with optical SerDes (serialiser/ deserialisers) rather than copper ones.
Optical interconnect, it argues, will have a three-stage evolution: starting with face-plate transceivers, moving to mid-board optics and then ASICS with optical interfaces. Such optical interconnect developments promise lower cost high-speed designs and new ways to architect systems.
Currently optics are largely confined to transceivers on a system׳s front panel. The exceptions are high-end supercomputer systems and emerging novel designs such as Compass-EOS's IP core router.
"The problem with the front panel is the density you can achieve is somewhat limited," says Bergey. Leading switch IC suppliers using a 40nm CMOS process are capable of a Terabit of switching. "That matches really well if you put a ton of QSFPs on the front panel," says Bergey.
But once switch IC vendors use the next CMOS process node, the switching capacity will rise to several Terabits. This becomes far more challenging to meet using front panel optics and will be more costly compared to putting board-mounted optics alongside the chip.
"When we build [silicon photonics] chips, we can package them in QSFPs for the front panel, or we can package them for mid-board optics," says Bergey.
"If it [silicon photonics] is viewed as exotic, it is never going to hit the volumes we aspire to."
The use of mid-board optics by system vendors is the second stage in the evolution of optical interconnect. "It [mid-board optics] is an intermediate step between how you move from copper I/O [input/output] to optical I/O," says Bergey.
The use of mid-board optics requires less power, especially when using 25Gbps signals, says Bergey: “You dont need as many [signal] retimers.” It also saves power consumed by the SerDes - from 2W for each SerDes to 1W, since the mid-board optics are closer and signals need not be driven all the way to the front panel. "You are saving 2W per 100 Gig and if you are doing several Terabits, that adds up," says Bergey.
The end game is optical I/O. This will be required wherever there are dense I/O requirements and where a lot of traffic is aggregated.
Luxtera, as a silicon photonics player, is pursuing an approach to integrate optics with VLSI devices. "We're in discussions with a lot of memory vendors, switch vendors and different ASIC providers," says Bergey.
Silicon photonics fab
Last year STMicroelectronics (ST) and Luxtera announced they would create a 300mm wafer silicon photonics process at ST's facility in Crolles, France.
Luxtera expects that line to be qualified, ramped and in production in 2014. Before then, devices need to be built, qualified and tested for their reliability.
"If you are a big systems company and you are betting on your flagship chip, you better have multiple sources," says Bergey. "That is what we are doing with ST: it drastically expands the total available market of silicon photonics and it is something that ST and Luxtera can benefit from.”
Having multiple sources is important, says Bergey: "If it [silicon photonics] is viewed as exotic, it is never going to hit the volumes we aspire to."
Part 2: Bell Labs on silicon photonics click here
Part 3: Is silicon photonics an industry game-changer? click here
Kotura demonstrates a 100 Gigabit QSFP
“QSFP will be the long-term winner at 100 Gig; the same way QSFP has been a high volume winner at 40 Gig”
Arlon Martin, Kotura
The device is aimed at plugging the gap between vertical-cavity surface-emitting laser (VCSEL) -based 100GBASE-SR10 designs that have span 100m, and the CFP-based 100GBASE-LR4 that has a 10km reach.
“It is aimed at the intermediate space, which the IEEE is looking at a new standard for," says Arlon Martin, vice president of marketing at Kotura.
The device is similar to Luxtera's 100 Gigabit-per-second (Gbps) QSFP, also detailed at the OFC/NFOEC 2013 exhibition, and is targeting the same switch applications in the data centre. “Where we differ is our ability to do wavelength-division multiplexing (WDM) on a chip,” says Martin. Kotura also uses third-party electronics such as laser drivers and transimpedance amplifiers (TIA) whereas Luxtera develops and integrates its own.
The Kotura QSFP uses four wavelengths, each at 25Gbps, that operate around 1550nm. “We picked 1550nm because that is where a lot of the WDM applications are," says Martin. “There are also some customers that want more than four channels.” The company says it is also doing development work at 1310nm.
Although Kotura's implementation doesn't adhere to an IEEE standard - the standard is still work in progress - Martin points out that the 10x10 MSA is also not an IEEE standard, yet is probably the best selling client-side 100Gbps interface.
Optical component and module vendors including Avago Technologies, Finisar, Oclaro, Oplink, Fujitsu Optical Components and NeoPhotonics all announced CFP2 module products at OFC/NFOEC 2013. The CFP2 is the next pluggable form factor on the CFP MSA roadmap and is approximately half the size of the CFP.
The advent of the CFP2 enables eight 100Gbps pluggable modules on a system's front panel compared to four CFPs. But with the QSFP, up to 24 modules can be fitted while 48 are possible when mounted double sidedly - ’belly-to-belly’ - across the panel. “QSFP will be the long-term winner at 100 Gig; the same way QSFP has been a high volume winner at 40 Gig,” says Martin.
The QSFP uses 28Gbps pins, which is also called the QSFP28, but Kotura refers to it 100Gbps product as a QSFP. The design consumes 3.5W and uses two silicon photonic chips. Kotura says 80 percent of the total power consumption is due to the electronics.
One of the two chips is the silicon transmitter which houses the platform for the four lasers (gain chips) combined as a four-channel array. Each is an external cavity laser where part of the cavity is within the indium phosphide device and the rest in the silicon photonics waveguide. The gain chips are flip-chipped onto the silicon. The transmitter also includes a grating that sets each laser's wavelength, four modulators, and a WDM multiplexer to combine the four wavelengths before transmission on the fibre.
Kotura's 4x25 Gig transmitter and receiver chips. Source: Kotura
The receiver chip uses a four-channel demultiplexer with each channel fed to a germanium photo-detector. Two chips are used as it is easier to package each as a transmitter optical sub-assembly (TOSA) or receiver optical sub-assembly (ROSA), says Martin. The 100Gbps QSFP will be generally available in 2014.
Disruptive system design
The recent Compass-EOS IP router announcement is a welcome development, says Kotura, as it brings the optics inside the system - an example of mid-board optics - as opposed to the front panel. Compass-EOS refers to its novel icPhotonics chip combining a router chip and optics as silicon photonics but in practice it is an integrated optics design. The 168 VCSELs and 168 photodetectors per chip is massively parallel interconnect, says Martin.
“The advantage, from our point of view of silicon photonics, is to do WDM on the same fibre in order to reduce the amount of cabling and interconnect needed,” he says. At 100 Gigabit this reduces the cabling by a factor of four and this will grow with more 25Gbps wavelength channels used to 10x or even 40x eventually.
“What we want to do is transition from the electronics to the optical domain as close to those large switching chips as possible,” says Martin. “Pioneers [like Compass-EOS] demonstrating that style of architecture are to be welcomed."
Kotura says that every company that is building large switching and routing ASICs is looking at various interface options. "We have talked to quite a few of them,” says Martin.
One solution suited to silicon photonics is to place the lasers on the front panel while putting the modulation, detection and WDM devices - packaged using silicon photonics - right next to the ASICs. This way the laser works at the cooler room temperature while the rest of the circuitry can be at the temperature of the chip, says Martin.
ECI Telecom demos 100 Gigabit over 4,600km
- 4,600km optical transmission over submarine cable
- The Tera Santa Consortium, chaired by ECI, will show a 400 Gigabit/ 1 Terabit transceiver prototype in the summer
- 100 Gigabit direct-detection module on hold as the company eyes new technology developments
"When we started the project it was not clear whether the market would go for 400 Gig or 1 Terabit. Now it seems that the market will start with 400 Gig."
Jimmy Mizrahi, ECI Telecom
ECI Telecom has transmitted a 100 Gigabit signal over 4,600km without signal regeneration. Using Bezeq International's submarine cable between Israel and Italy, ECI sent the 100 Gigabit-per-second (Gbps) signal alongside live traffic. The Apollo optimised multi-layer transport (OMLT) platform was used, featuring a 5x7-inch MSA 100Gbps coherent module with soft-decision, forward error correction (SD-FEC).
"We set a target for the expected [optical] performance with our [module] partner and it was developed accordingly," says Jimmy Mizrahi, head of the optical networking line of business at ECI Telecom. "The [100Gbps] transceiver has superior performance; we have heard that from operators that have tested the module's capabilities and performance."
One geography that ECI serves is the former Soviet Union which has large-span networks and regions of older fibre.
Tera Santa Consortium
ECI used the Bezeq trial to also perform tests as part of the Tera Santa Consortium project involving Israeli optical companies and universities. The project is developing a transponder capable of 400 Gigabit and 1 Terabit rates. The project is funded by seven participating firms and the Israeli Government.
"When we started the project it was not clear whether the market would go for 400 Gig or 1 Terabit,” says Mizrahi. “Now it seems that the market will start with 400 Gig."
The Tera Santa Consortium expects to demonstrate a 1 Terabit prototype in August and is looking to extend the project a further three years.
100 Gigabit direct detection
In 2012 ECI announced it was working with chip company, MultiPhy, to develop a 100 Gigabit direct-detection module. The 100 Gigabit direct detection technology uses 4x28Gbps wavelengths and is a cheaper solution than 100Gbps coherent. The technology is aimed at short reach (up to 80km) links used to connect data centres, for example, and for metro applications.
“We have changed our priorities to speed up the [100Gbps] coherent solution,” says Mizrahi. “It [100Gbps direct detection] is still planned but has a lower priority.”
ECI says it is monitoring alternative technologies coming to market in the next year. “We are taking it slowly because we might jump to new technologies,” says Mizrahi. “The line cards will be ready, the decision will be whether to go for new technologies or for direct detection."
Mizrahi would not list the technologies but hinted they may enable cheaper coherent solutions. Such coherent modules would not need SD-FEC to meet the shorter reach, metro requirements. Such a module could also be pluggable, such as the CFP or even the CFP2, and use indium phosphide-based modulators.
“For certain customers pricing will always be the major issue,” says Mizrahi. “If you have a solution at half the price, they will take it.”
Cisco Systems demonstrates 100 Gigabit technologies
* Announces 100 Gigabit transmission over 4,800km
"CPAK helps accelerate the feasibility and cost points of deploying 100Gbps"
Stephen Liu, Cisco
Cisco Sytems has announced that its 100 Gigabit coherent module has achieved a reach of 4,800km without signal regeneration. The span was achieved in the lab and the system vendor intends to verify the span in a customer's network.
The optical transmission system achieved a reach of 3,000km over low-loss fibre when first announced in 2012. The extended reach is not a result of a design upgrade, rather the 100 Gigabit-per-second (Gbps) module is being used on a link with Raman amplification.
Cisco says it started shipping its 100Gbps coherent module in June 2012. "We have shipped over 2,000 100Gbps coherent dense WDM ports," says Sultan Dawood, marketing manager at Cisco. The 100Gbps ports include line-side 100Gbps interfaces integrated within Cisco's ONS 15454 multi-service transport platform and its CRS core router supporting its IP-over-DWDM elastic core architecture.
Cisco has also coupled the ASR 9922 series router to the ONS 15454. "We are extending what we have done for IP and optical convergence in the core," says Stephen Liu, director of market management at Cisco. "There is now a common solution to the [network] edge."
None of Cisco's customers has yet used 100Gbps over a 3,000km span, never mind 4,800km. But the reach achieved is an indicator of the optical transmission performance. "The [distance] performance is really a proxy for usefulness," says Liu. "If you take that 3,000km over low-loss fibre, what that buys you is essentially a greater degree of tolerance for existing fibre in the ground."
Much industry attention is being given to the next-generation transmission speeds of 400Gbps and one Terabit. This requires support for super-channels - multi-carrier signals to transmit 400Gbps and one Terabit as well as flexible spectrum to pack the multi-carrier signals efficiently across the fibre's spectrum. But Cisco argues that faster transmission is only one part of the engineering milestones to be achieved, especially when 100Gbps deployment is still in its infancy.
To benefit 100Gbps deployments, Cisco has officially announced its own CPAK 100Gbps client-side optical transceiver after discussing the technology over the last year. "CPAK helps accelerate the feasibility and cost points of deploying 100Gbps," says Liu.
CPAK
The CPAK is Cisco' first optical transceiver using silicon photonics technology following its acquisition of LightWire. The CPAK is a compact optical transceiver to replace the larger and more power hungry 100Gbps CFP interfaces.
The CPAK is being launched at the same time as many companies are announcing CFP2 multi-source agreement (MSA) optical transceiver products. Cisco stresses that the CPAK conforms to the IEEE 100GBASE-LR4 and -SR10 100Gbps standards. Indeed at OFC/NFOEC it is demonstrating the CPAK interfacing with a CFP2.
The CPAK will be used across several Cisco platforms but the first implementation is for the ONS 15454.
The CPAK transceiver will be generally available in the summer of 2013.
OFC/NFOEC 2013 to highlight a period of change
Next week's OFC/NFOEC conference and exhibition, to be held in Anaheim, California, provides an opportunity to assess developments in the network and the data centre and get an update on emerging, potentially disruptive technologies.
Source: Gazettabyte
Several networking developments suggest a period of change and opportunity for the industry. Yet the impact on optical component players will be subtle, with players being spared the full effects of any disruption. Meanwhile, industry players must contend with the ongoing challenges of fierce competition and price erosion while also funding much needed innovation.
The last year has seen the rise of software-defined networking (SDN), the operator-backed Network Functions Virtualization (NFV) initiative and growing interest in silicon photonics.
SDN has already being deployed in the data centre. Large data centre adopters are using an open standard implementation of SDN, OpenFlow, to control and tackle changing traffic flow requirements and workloads.
Telcos are also interested in SDN. They view the emerging technology as providing a more fundamental way to optimise their all-IP networks in terms of processing, storage and transport.
Carrier requirements are broader than those of data centre operators; unsurprising given their more complex networks. It is also unclear how open and interoperable SDN will be, given that established vendors are less keen to enable their switches and IP routers to be externally controlled. But the consensus is that the telcos and large content service providers backing SDN are too important to ignore. If traditional switching and routers hamper the initiative with proprietary add-ons, newer players will willing fulfill requirements.
Optical component players must assess how SDN will impact the optical layer and perhaps even components, a topic the OIF is already investigating, while keeping an eye on whether SDN causes market share shifts among switch and router vendors.
The ETSI Network Functions Virtualization (NFV) is an operator-backed initiative that has received far less media attention than SDN. With NFV, telcos want to embrace IT server technology to replace the many specialist hardware boxes that take up valuable space, consume power, add to their already complex operations support systems (OSS) while requiring specialist staff. By moving functions such as firewalls, gateways, and deep packet inspection onto cheap servers scaled using Ethernet switches, operators want lower cost systems running virtualised implementations of these functions.
The two-year NFV initiative could prove disruptive for many specialist vendors albeit ones whose equipment operate at higher layers of the network, removed from the optical layer. But the takeaway for optical component players is how pervasive virtualisation technology is becoming and the continual rise of the data centre.
Silicon photonics is one technology set to impact the data centre. The technology is already being used in active optical cables and optical engines to connect data centre equipment, and soon will appear in optical transceivers such as Cisco Systems' own 100Gbps CPAK module.
Silicon photonics promises to enable designs that disrupt existing equipment. Start-up Compass-EOS has announced a compact IP core router that is already running live operator traffic. The router makes use of a scalable chip coupled to huge-bandwidth optical interfaces based on 168, 8 Gigabit-per-second (Gbps) vertical-cavity surface-emitting lasers (VCSELs) and photodetectors. The Terabit-plus bandwidth enables all the router chips to be connected in a mesh, doing away with the need for the router's midplane and switching fabric.
The integrated silicon-optics design is not strictly silicon photonics - silicon used as a medium for light - but it shows how optics is starting to be used for short distance links to enable disruptive system designs.
Some financial analysts are beating the drum of silicon photonics. But integrated designs using VCSELs, traditional photonic integration and silicon photonics will all co-exist for years to come and even though silicon photonics is expected to make a big impact in the data centre, the Compass-EOS router highlights how disruptive designs can occur in telecoms.
Market status
The optical component industry continues to contend with more immediate challenges after experiencing sharp price declines in 2012.
The good news is that market research companies do not expect a repeat of the harsh price declines anytime soon. They also forecast better market prospects: The Dell'Oro Group expects optical transport to grow through 2017 at a compound annual growth rate (CAGR) of 10 percent, while LightCounting expects the optical transceiver market to grow 50 percent, to US $5.1bn in 2017. Meanwhile Ovum estimates the optical component market will grow by a mid-single-digit percent in 2013 after a contraction in 2012.
In the last year it has become clear how high-speed optical transport will evolve. The equipment makers' latest generation coherent ASICs use advanced modulation techniques, add flexibility by trading transport speed with reach, and use super-channels to support 400 Gigabit and 1 Terabit transmissions. Vendors are also looking longer term to techniques such as spatial-division multiplexing as fibre spectrum usage starts to approach the theoretical limit.
Yet the emphasis on 400 Gigabit and even 1 Terabit is somewhat surprising given how 100 Gigabit deployment is still in its infancy. And if the high-speed optical transmission roadmap is now clear, issues remain.
OFC/NFOEC 2013 will highlight the progress in 100 Gigabit transponder form factors that follow the 5x7-inch MSA, 100 Gigabit pluggable coherent modules, and the uptake of 100 Gigabit direct-detection modules for shorter reach links - tens or hundreds of kilometers - to connect data centres, for example.
There is also an industry consensus regarding wavelength-selective switches (WSSes) - the key building block of ROADMs - with the industry choosing a route-and-select architecture, although that was already the case a year ago.
There will also be announcements at OFC/NFOEC regarding client-side 40 and 100 Gigabit Ethernet developments based on the CFP2 and CFP4 that promise denser interfaces and Terabit capacity blades. Oclaro has already detailed its 100GBASE-LR4 10km CFP2 while Avago Technologies has announced its 100GBASE-SR10 parallel fibre CFP2 with a reach of 150m over OM4 fibre.
The CFP2 and QSFP+ make use of integrated photonic designs. Progress in optical integration, as always, is one topic to watch for at the show.
PON and WDM-PON remain areas of interest. Not so much developments in state-of-the-art transceivers such as for 10 Gigabit EPON and XG-PON1, though clearly of interest, but rather enhancements of existing technologies that benefit the economics of deployment.
The article is based on a news analysis published by the organisers before this year's OFC/NFOEC event.