Rockley Photonics showcases its in-packaged design at OFC
Rockley Photonics has showcased its in-packaged optics design to select customers and development partners at the OFC show being held in San Diego this week.
The packaged design includes Rockley's own 2 billion transistor layer 3 router chip, and its silicon photonics-based optical transceivers. The layer 3 router chip, described as a terabit device, also includes mixed-signal circuits needed for the optical transceevers' transmit and receive paths.
Rockley says it is using 500m-reach PSM4 transceivers for the design and that while a dozen ribbon cables are shown, this does not mean there are 12 100-gigabit PSM4 transceivers. The company is not saying what the total optical input-output is.