The era of 400G coherent pluggables finally emerges
Part 1: 7nm coherent DSPs, ZR and ZR+
The era of 400-gigabit coherent pluggable modules has moved a step closer with Inphi’s announcement of its Canopus coherent digital signal processor (DSP) and its QSFP-DD ColorZ II optical module.
NeoPhotonics has also entered the fray, delivering first samples of its 400-gigabit ClearLight CFP2-DCO module that uses the Canopus DSP.
The ColorZ II and ClearLight modules support the 400ZR OIF standard used to link data centres up to 120km apart. They also support extended modes, known as ZR+, that is not standardised.
ZR+’s modes include 400 Gigabit-per-second (Gbps) over distances greater than 400ZR’s 120km and lower data rates over metro-regional and long-haul distances.
The announcements of the Canopus DSP and 400-gigabit pluggable coherent modules highlight the approaches being taken for ZR+. Optical module vendors are aligning around particular merchant DSPs such that interoperability exists but only within each camp.
The first camp involves Inphi and three other module vendors, one being NeoPhotonics. The second camp is based on the OpenZR+ specification that offers interoperability between the DSPs of the merchant players, Acacia Communications and NTT Electronics (NEL). Cisco is in the process of acquiring Acacia.
Market analysts, however, warn that such partial interoperability for ZR+ harms the overall market opportunity for coherent pluggables.
“ZR+ should be interoperable like ZR, and come along with the hard decisions the ZR standard required,” says Andrew Schmitt, founder and directing analyst at research form, Cignal AI.
The optical module vendors counter that only with specialist designs – designs that are multi-sourced – can the potential of a coherent DSP be exploited.
Applications
The advent of 400-gigabit coherent optics within compact client-side form factors is a notable development, says Inphi. “The industry has been waiting for this inflextion point of having, for the first time, 400-gigabit coherent pluggables that go on router and switch interfaces,” says Pranay Aiya, vice president of product marketing and applications engineering at Inphi.
“IP over DWDM has never happened; we have all heard about it till the cows come home,” says Aiya.
IP-over-DWDM failed to take off because of the power and space demands of coherent optics, especially when router and switch card slots come at a premium. Using coherent optics on such platforms meant trading off client-side faceplate capacity to fit bulkier coherent optics. This is no longer the case with the advent of QSFP-DD and OSFP coherent modules.
“If you look at the reasons why IP-over-DWDM – coloured optics directly on routers – failed, all of those reasons have changed,” says Schmitt. The industry is moving to open line systems, open network management, and more modular network design.
“All of the traffic is IP and layer-1 switching and grooming isn’t just unnecessary, it is more expensive than low-feature layer-2 switching,” says Schmitt, adding that operators will use pluggables wherever the lower performance is acceptable. Moreover, this performance gap will narrow with time.
The Canopus DSP also supports ZR+ optical performance and, when used within a CFP2-DCO module with its greater power enveloped than OSFP and QSFP-DD, enables metro and long-haul distances, as required by the telecom operators. This is what Neophotonics has announced with its ClearLight CFP2-DCO module.
Canopus
Inphi announced the Canopus DSP last November and revealed a month later that it was sampling its first optical module, the ColorZ II, that uses the Canopus DSP. The ColorZ II is a QSFP-DD pluggable module that supports 400ZR as well as the ZR+ extended modes.
Inphi says that, given the investment required to develop the 7nm CMOS Canopus, it had to address the bulk of the coherent market.
“We were not going after the ultra-long-haul and submarine markets but we wanted pluggables to address 80-90 per cent of the market,” says Aiya.
This meant developing a chip that would support the OIF’s 400ZR, 200-gigabit using quadrature phased-shift keying (QPSK) modulation for long haul, and deliver 400-gigabit over 500-600km.
The Canopus DSP also supports probabilistic constellation shaping (PCS), a technology that until now has been confined to the high-end coherent DSPs developed by the leading optical systems vendors.
With probabilistic shaping, not all the constellation points are used. Instead, those with lower energy are favoured; points closer to the origin on a constellation graph. The only time all the constellation points are used is when sending the maximum data rate for a given modulation scheme.
Choosing the inner, lower-energy constellation points more frequently than the outer points to send data reduces the average energy and improves the signal-to-noise ratio. To understand why, the symbol error rate at the receiver is dominated by the distance between neighbouring points on the constellation. Reducing the average energy keeps the distance between the points the same, but since a constant signal power level is used for DWDM transmission, applying gain increases the distance between the constellation points. The result is improved optical performance.
Probabilistic shaping also allows an exact number of bits-per-symbol to be sent, even non-integer values.
For example, using standard modulation schemes such as 64-QAM with no constellation shaping, 6 bits-per-symbol are sent. Using shaping and being selective as to which constellation points are used, 5.7 bits-per-symbol could be sent, for example. This enables finer control of the sent data, enabling operators to squeeze the maximum data rate to suit the margins on a given fibre link.
“This is the first time a DSP with probabilistic shaping has been available in a size and power that enables pluggables,” says Aiya.
The resulting optical performance using the Canopus is up to 1,500km at 300Gbps signals and up to 2,000km for 200Gbps transmissions (see Table above). As for baud rates, the DSP ranges from 30+ to the mid-60s Gigabaud.
Inphi also claims a 75 per cent reduction in power consumption of the Canopus compared to 16nm CMOS DSPs found in larger, 4×5-inch modules.
Several factors account for the sharp power reduction: the design of the chip’s architecture and physical layout, and the use of 7nm CMOS. The Canopus uses functional blocks that extend the reach, and these can be turned off to reduce the power consumption when lower optical performance is acceptable.
The architectural improvements and the physical layout account for half of the overall power savings, says Aiya, with the rest coming from using a 7nm CMOS.
The result is a DSP a third the size of 16nm DSPs. “It [pluggables] requires the DSP to be very small; it’s not a paperweight anymore,” says Aiya.
400ZR and ZR+
The main challenge for the merchant coherent DSP camps is the several, much larger 400ZR eco-systems from Ciena, Cisco and Huawei.
“Each one of these eco-systems will be larger than the total merchant market of 400ZR,” says Vladimir Kozlov, CEO and founder of LightCounting. The system vendors will make sure that their products offer something extra if plugged into their equipment while maintaining interoperability. “This could be some simple AI-like features monitoring the link performance and warning customers of poor operation of devices on the other side of the link if these are made by another supplier,” says Kozlov.
LightCounting says that ZR+ units will be half to a third of the the number of 400ZR units shipped. However, each ZR+ module will command a higher selling price.
Regarding the ZR+ camps, one standardisation effort is OpenZR+ that adopts the forward-error correction (oFEC) scheme of the OpenROADM MSA, supports multiplexing of 100 Gigabit Ethernet (GbE) and 200GbE client signals, and different line rates – 100-400Gbps – to achieve greater reaches.
The backers of OpenZR+ include the two merchant DSP vendors, Acacia and NEL, as well as Fujitsu Optical Components, Lumentum, and Juniper Networks.
The second ZR+ camp includes four module-makers that are adopting the Canopus: Inphi, Molex Optoelectronics, NeoPhotonics and an unnamed fourth company. According to Schmitt, the unnamed module maker is II-VI. II-VI declined to comment when asked to confirm.
Schmitt argues that ZR+ should be interoperable, just like 400ZR. “I think NEL, Acacia, and Inphi should have an offsite and figure this out,” he says. “These three companies are in a position to nail down the specs and create a large, disruptive coherent pluggable market.”
Simon Stanley, founder and principal consultant at Earlswood Marketing Limited, expects several ZR+ solutions to emerge but that the industry will settle on a common approach. “You will initially see both ZR+ and OpenZR+,” says Stanley. “ZR+ will be specific to each operator but over time I expect OpenZR+ or something similar to become the standard solution.”
But the optical vendors stress the importance of offering differentiated designs to exploit the coherent DSP’s full potential. And maximising a module’s optical performance is something operators want.
“We are all for standards where it makes sense and where customers want it,” says Inphi’s Aiya. “But for customers that require the best performance, we are going to offer them an ecosystem around this DSP.”
“It is always a trade-off,” adds Ferris Lipscomb, vice president of marketing at NeoPhotonics. “More specialised designs that aren’t interoperable can squeeze more performance out; interoperable has to be the lowest common denominator.”
Next-generation merchant DSPs
The next stage in coherent merchant DSP development is to use a 5nm CMOS process, says Inphi. Such a state-of-the-art [CMOS] process will be needed to double capacity again while keeping the power consumption constant.
The optical performance of a 5nm coherent DSP in a pluggable will approach the high-end coherent designs. “It [the optical performance of the two categories] is converging,” says Aiya.
However, demand for such a device supporting 800 gigabits will take time to develop. Several years have passed for demand for 400-gigabit client-side optics to ramp and there will be a delay before telecom operators need 400-gigabit wavelengths in volume, says Inphi.
LightCounting points out that it will take Inphi and its ecosystem of suppliers at least a year to debug their products and demonstrate interoperability.
“And keep in mind that we are talking about the industry that is changing very slowly,” concludes Kozlov.
Oclaro uses Acacia’s Meru DSP for its CFP2-DCO
Oclaro will use Acacia Communications’ coherent DSP for its pluggable CFP2 Digital Coherent Optics (CFP2-DCO) module. The module will be compatible with Acacia’s own CFP2-DCO, effectively offering customers a second source.
Tom Williams This is the first time Acacia is making its coherent DSP technology available to a fellow module maker, says Tom Williams, Acacia’s senior director, marketing.
Acacia benefits from the deal by expanding the market for its technology, while Oclaro gains access to a leading low-power coherent DSP, the Meru, and can bring to market its own CFP2-DCO product.
Williams says the move was encouraged by customers and that having a second source and achieving interoperability will drive CFP2-DCO market adoption. That said, Acacia is not looking for further module partners. “With two strong suppliers, we don’t see a need to add additional ones,” says Williams.
“This agreement is a sign that the market is reaching maturity, with suppliers transitioning from grabbing market share at all costs to more rational strategies,” says Vladimir Kozlov, CEO and founder of LightCounting Market Research.
CFP2-DCO
The CFP2-DCO is a dense wavelength-division multiplexing module that supports 100-gigabit and 200-gigabit data rates.
With the CFP2-DCO design, the coherent DSP sits within the module, unlike the CFP2 Analog Coherent Optics (CFP2-ACO) where the DSP chip is external, residing on the line card.
According to Kevin Affolter, Oclaro’s vice president strategic marketing, the company looked at several merchant and non-merchant coherent DSPs but chose the Meru due to its low power consumption and its support for 200 gigabits using 8-ary quadrature amplitude modulation (8-QAM) as well as the 16-QAM scheme. Using 8-QAM extends the optical reach of 200-gigabit wavelengths.
This agreement is a sign that the market is reaching maturity, with suppliers transitioning from grabbing market share at all costs to more rational strategies
At 100 gigabits the CFP2-DCO achieves long-haul distances of 2,000km whereas at 200 gigabit at 8-QAM, the reach is in excess of 1,000km. The 8-QAM requires a wider passband than the 16-QAM, however, such that in certain metro networks where the signal passes through several ROADM stages, it is better to use the 16-QAM mode, says Acacia.
Source: Acacia, Gazettabyte
Oclaro’s design will combine the Meru with its indium phosphide-based optics whereas Acacia’s CFP2-DCO uses silicon photonics technology. The power consumption of the CFP2-DCO module is of the order of 20W.
The two companies say their CFP2-DCO modules will be compatible with the multi-source agreement for open reconfigurable add-drop multiplexers (ROADMs). The Open ROADM MSA is backed by 16 companies, eight of which are operators. The standard currently only defines 100-gigabit transmission based on a hard-decision forward-error correction.
“There are several carriers, AT&T being the most prominent, within Open ROADM,” says Affolter. “It makes sense for both companies to make sure the needs of Open ROADM are addressed.”
Coherent shift
In 2017, Oclaro was one of three optical module companies that signed an agreement with Ciena to use the systems vendor’s WaveLogic Ai coherent DSP to develop a 400-gigabit transponder.
Kevin Affolter
Affolter says the Ciena and Acacia agreements should be seen as distinct; the 400-gigabit design is a large, 5x7-inch non-pluggable module designed for maximum reach and capacity. “The deals are complementary and this announcement has no impact on the Ciena announcement,” says Affolter.
Does the offering of proprietary DSPs to module makers suggest a shift in coherent that has always been seen as a strategic technology that allows for differentiation?
Affolter thinks not. “There are several vertically integrated vendors with their own DSPs that will continue to leverage their investment as much as they can,” he says. “But there is also an evolution of end customers and network equipment manufacturers that are moving to more pluggable solutions and that is where the -DCO really plays.”
Oclaro expects to have first samples of its CFP2-DCO by year-end. Meanwhile, Acacia’s CFP2-DCO has been generally available for over six months.
Coherent optics players target the network edge for growth
Part 1: Coherent developments
The market for optical links for reaches between 10km and 120km is emerging as a fierce battleground between proponents of coherent and direct-detection technologies.
Interest in higher data rates such as 400 gigabits is pushing coherent-based optical transmission from its traditional long-distance berth to shorter-reach applications. “That tends to be where the growth for coherent has come from as it has migrated from long-haul to metro,” says Tom Williams, senior director of marketing at Acacia Communications, a coherent technology supplier.
Source: Acacia Communications, Gazettabyte
Williams points to the Optical Internetworking Forum’s (OIF) ongoing work to develop a 400-gigabit link for data centre interconnect. Dubbed 400ZR, the project is specifying an interoperable coherent interface that will support dense wavelength-division multiplexing (DWDM) links for distances of at least 80km.
Meanwhile, the IEEE standards group defining 400 Gigabit Ethernet has issued a Call-For-Interest to determine whether to form a Study Group to look at 400-Gigabit applications beyond the currently defined 10km 400GBASE-LR8 interface.
“Coherent moving to higher-volume, shorter-reach solutions shows it is not just a Cadillac product,” says Williams. Higher-volume markets will also be needed to fund coherent chip designs using advanced CMOS process nodes. “Seven nanometer [CMOS] becomes a very expensive prospect,” says Williams. “The traditional business case is not going to be there without finding higher volumes.”
Coherent moving to higher-volume, shorter-reach solutions shows it is not just a Cadillac product
Pico DSP
Acacia detailed its next-generation high-end coherent digital signal processor (DSP) at the OFC show held in Los Angeles in March.
Tom WilliamsDubbed Pico, the DSP will support transmission speeds of up to 1.2 terabits-per-second using two carriers, each carrying 600 gigabits of data implemented using 64-ary quadrature amplitude modulation (64QAM) and a 64 gigabaud symbol rate. The 16nm CMOS dual-core DSP also features an internal crossbar switch to support a range of 100-gigabit and 400-gigabit client interfaces.
ADVA Optical Networking is using the Pico for its Teraflex data centre interconnect product. The Teraflex design supports 3.6 terabits of line-side capacity in a single rack unit (1RU). Each 1RU houses three “sleds”, each supporting two wavelengths operating at up to 600 gigabits-per-second (Gbps).
But ADVA Optical Networking also detailed at OFC its work with leading direct-detection technology proponents, Inphi and Ranovus. For the data centre interconnect market, there is interest in coherent and direct-detection technologies, says ADVA.
Detailing the Pico coherent DSP before it is launched as a product is a new development for Acacia. “We knew there would be speculation about ADVA’s Teraflex technology and we preferred to be up front about it,” says Williams.
The 16nm Pico chip was also linked to an Acacia post-deadline paper at OFC detailing the company’s progress in packaging its silicon photonics chips using ball grid array (BGA) technology. Williams stresses that process issues remain before its photonic integrated circuit (PIC) products will use BGA packaging, an approach that will simplify and reduce manufacturing costs.
“You are no longer running the board with all the electronics through a surface mount line and then have technicians manually solder on the optics,” says Williams. Moreover, BGA packaging will lead to greater signal integrity, an important consideration as the data rates between the coherent DSP and the PIC increase.
It is an endorsement of our model but I do not think it is the same as ours. You still have to have someone providing the DSP and someone else doing the optics
Coherent competition
Ciena's recent announcement that it is sharing its WaveLogic Ai coherent DSP technology with optical module vendors Lumentum, Oclaro and NeoPhotonics is seen as a response to Acacia’s success as a merchant supplier of coherent modules and coherent DSP technologies.
Williams says Acacia’s strategy remains the same when asked about the impact of the partnership between Ciena and the optical module makers: to continue being first to market with differentiated products.
One factor that has helped Acacia compete with merchant suppliers of coherent DSPs - NEL and ClariPhy, now acquired by Inphi - is that it also designs the silicon photonics-based optics used in its modules. This allows a trade-off between the DSP and the optics to benefit the overall system design.
A challenge facing the three optical module makers working with Ciena is that each one will have to go off and optimise their design, says Williams. “It is an endorsement of our model but I do not think it is the same as ours,” he says. “You still have to have someone providing the DSP and someone else doing the optics.”
Coherent roadmap
Acacia has managed to launch a new coherent DSP product every year since 2011 (see diagram, above). In 2015 it launched its Denali DSP, the first to operate at line rates greater than 100Gbps.
Last year it announced the Meru, a low-power DSP for its CFP2-DCO module. The CFP2-DCO operates at 100Gbps using polarisation multiplexing, quadrature phase-shift keying, (PM-QPSK) and two 200Gbps modes: one using 16-ary quadrature amplitude modulation (PM-16QAM) and a longer reach variant, implemented using a higher baud rate and 8-ary quadrature amplitude modulation (PM-8QAM). The CFP2-DCO is already starting to be designed into platforms.
Since 2014, Acacia has launched a low-power DSP design every even year and a high-end DSP every odd year, with the Pico being the latest example.
Acacia has not said when the Pico coherent DSP will be generally available but ADVA Optical Networking has said it expects to launch the Teraflex in early 2018.
Acacia looks to co-package its coherent PIC and DSP-ASIC
- Acacia Communications is working to co-package its coherent DSP and its silicon photonics transceiver chip.
- The company is also developing a digital coherent optics module that will support 400 gigabit.
Acacia Communications is working to co-package its coherent DSP and its silicon photonics transceiver chip. The line-side optical transceiver company is working on a digital coherent optics module that will support 400 gigabits.
Acacia announced last November that it was sampling the industry’s first CFP2 Digital Coherent Optics (CFP2-DCO) that supports 100- and 200-gigabit line rates. The CFP2-DCO integrates the DSP and its silicon photonics chip within a CFP2 module, which is half the size of a CFP module, with each chip packaged separately.
The CFP2-DCO adds to the company’s CFP2-ACO design that was announced a year ago. In the CFP2-ACO, the CFP2 module contains just the optics with the DSP-ASIC chip on the same line card connected to the module via a special high-speed interface connector.
Now, Acacia is working to co-package the two chips, which will not only improve the performance of its CFP2-DCO but also enable new, higher-performance optical modules such as a 400-gigabit DCO. The Optical Internetworking Forum announced a new implementation agreement last December for an interoperable 400-gigabit ZR (80km) coherent interface.
Both [the DSP and silicon photonics chip] are based on CMOS processes. The next step for Acacia is to bring them into a single package.
Portfolio upgrades
Acacia has also upgraded its existing portfolio of coherent transceivers. The company has integrated the enhanced silicon photonics coherent transceiver in its AC100-CFP and its AC-400 5x7-inch modules.
The silicon-photonics transceiver achieves a more efficient coupling of light in and out of the chip and uses an improved modulator driver design that reduces the overall power consumption. The design also supports flexible grid, enabling channel sizes of 37.5GHz in addition to fixed-grid 50GHz channels.
The resulting AC100-CFP module has a greater reach of 2,500km and a lower power consumption than the first generation design announced in 2014. The enhanced PIC has also been integrated within the AC-400. The AC-400, announced in 2015, integrates two silicon photonics chips to support line rates of 200, 300 and 400 gigabits.
CFP2-DCO
Acacia is using the coherent transceiver photonic integrated circuit (PIC), first used in its CFP2-ACO, alongside a new coherent DSP to integrate the optics and DSP within the compact CFP2.
“The third-generation PIC is a mini PIC; in a gold box that is about the size of a dime, which is a third of the size of our original PIC,” says Benny Mikkelsen, founder and CTO of Acacia.
One design challenge with its latest DSP was retaining the reach of the original DSP used in the AC100-CFP while lowering its power consumption. Having an inherently low-power coherent DSP design in the first place is one important factor. Mikkelsen says this is achieved based on several factors such as the DSP algorithms chosen and how they are implemented in hardware, the clock frequencies used within the chip, how the internal busses are implemented, and the choice of bits-per-symbol used for the processing.
The resulting DSP’s power consumption can be further reduced by using an advanced CMOS process. Acacia uses a 16nm CMOS process for its latest DSP.
Other challenges to enable a CFP2-DCO module include reducing the power consumption of the optics and reducing the packaging size. “The modulator driver is the piece part that consumes the most power on the optics side,” says Mikkelsen.
Acacia's CFP2-DCO supports polarisation multiplexing, quadrature phase-shift keying (PM-QPSK) for 100 gigabits, and two modulation schemes: polarisation multiplexing, 8-ary quadrature amplitude multiplexing (PM-8QAM) and 16-ary QAM - for 200-gigabit line rates. In contrast, its -ACO supports just PM-QPSK and PM-16QAM.
At 100 gigabits, the DSP consumes about half the power of the Sky DSP used in the original AC100. Using PM-8QAM for 200 gigabits means the new DSP and optics support a higher baud rate - some 45 gigabaud compared to the traditional 32-35 gigabaud used for 100 and 200-gigabit transmission. However, while this increases the power consumption, the benefit of 8QAM is a 200-gigabit reach beyond 1,000km.
Mikkelsen stresses that a key reason the company can achieve a CFP2-DCO design is having both technologies in-house: “You can co-optimise the DSP and the silicon photonics”.
We think, at least in the near term, that the OSPF module seems to be a good form factor to work on
ACO versus DCO
Since Acacia now offers both the CFP2-ACO and CFP2-DCO modules, it is less concerned about how the relative demand for the two modules develops. “We don’t care too much which one is going to have the majority of the market,” says Mikkelsen. That said, Acacia believes that the CFP2-DCO market will become the larger of the two.
When the CFP2-ACO was first considered several years ago, the systems vendors and optical module makers shared a common interest. Systems vendors wanted to use their custom coherent DSP-ASICs while the -ACO module allowed component makers that didn't have the resources to develop their own DSP to address the market with their optics. It was also necessary to separate the DSP and the optics if the smaller CFP2 form factor was to be used.
But bringing CFP2-ACOs to volume production has proved more difficult than first envisaged. The CFP2-DCO is far easier to use, says Mikkelsen. The module can be plugged straight into equipment whereas the CFP2-ACO must be calibrated by a skilled optical engineer when a wavelength is first turned up.
Future work
Acacia is now looking at new module form factors and new packaging technologies. “Both [the DSP and silicon photonics chip] are based on CMOS processes,” says Mikkelsen. “The next step for Acacia is to bring them into a single package.”
In addition to the smaller size, a single package promises a slightly lower power consumption as well as manufacturing cost advantages. “We also expect to see higher performance once the DSP and optics are sitting next to each other which we believe will improve signal integrity between the two,” says Mikkelsen.
Acacia is not waiting for any industry challenges to be overcome for a single-package design to be achieved. The company points out that its silicon photonics chip is not temperature sensitive, aiding its co-packaging with the DSP.
Acacia is working on a 400-gigabit DCO design and is looking at several potential module types. The company is a member of the OSFP module MSA as well as the Consortium of On-Board Optics (COBO) which has started a coherent working group. “We think, at least in the near term, that the OSPF module seems to be a good form factor to work on,” says Mikkelsen.