Broadcom's Thor 2 looks to hammer top spot in AI NICs

Broadcom has announced the availability of network interface cards (NICs) for large-scale artificial intelligence (AI) computers. 

Jas Tremblay

The NIC cards are using Broadcom's Thor 2 chip which started sampling in 2023 and is now in volume production.

Jas Tremblay, vice president and general manager of the data center solutions group at Broadcom, says the Thor 2 is the industry's first 400 gigabit Ethernet (GbE) NIC device to be implemented in a 5nm CMOS process.  

"It [the design] gives customers choices and freedom when they're building their AI systems such that they can use different NICs with different [Ethernet] switches," says Tremblay.

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Edgecore exploits telecom’s open-networking opportunity

Part 2: Open networking

Edgecore Networks is expanding its open networking portfolio with cell-site gateways and passive optical networking (PON) platforms. 

The company is backing two cell-site gateway designs that aggregate traffic from baseband units for 4G and 5G mobile networks. One design is from the Open Compute Project (OCP) that is available now and the second is from the Telecom Infra Project (TIP) that is planned for 2019 (see table).

Edgecore has also announced PON optical line terminal (OLT) platforms addressing 10-gigabit XGS-PON and GPON.

Source: ADVA, Edgecore Networks

Edgecore is a wholly-ownedsubsidiary of Accton Technology, a Taiwanese original design manufacturer (ODM) employing over 700 networking engineers that reported revenues exceeding $1.2 billion in 2017.

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Switch chips not optics set the pace in the data centre

Broadcom is doubling the capacity of its switch silicon every 18-24 months, a considerable achievement given that Moore’s law has slowed down. 

Last December, Broadcom announced it was sampling its Tomahawk 3 - the industry’s first 12.8-terabit switch chip - just 14 months after it announced its 6.4-terabit Tomahawk 2.

Rochan SankarSuch product cycle times are proving beyond the optical module makers; if producing next-generation switch silicon is taking up to two years, optics is taking three, says Broadcom. 

“Right now, the problem with optics is that they are the laggards,” says Rochan Sankar, senior director of product marketing at switch IC maker, Broadcom. “The switching side is waiting for the optics to be deployable.”

The consequence, says Broadcom, is that in the three years spanning a particular optical module generation, customers have deployed two generations of switches. For example, the 3.2-terabit Tomahawk based switches and the higher-capacity Tomahawk 2 ones both use QSFP28 and SFP28 modules. 

In future, a closer alignment in the development cycles of the chip and the optics will be required, argues Broadcom.

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