The future of optical I/O is more parallel links

Chris Cole has a lofty vantage point regarding how optical interfaces will likely evolve.

As well as being an adviser to the firm II-VI, Cole is Chair of the Continuous Wave-Wavelength Division Multiplexing (CW-WDM) multi-source agreement (MSA). 

Chris Cole

The CW-WDM MSA recently published its first specification document defining the wavelength grids for emerging applications that require eight, 16 or even 32 optical channels.

And if that wasn’t enough, Cole is also the Co-Chair of the OSFP MSA, which will standardise the OSFP-XD (XD standing for extra dense) 1.6-terabit pluggable form factor that will initially use 16, 100 gigabits-per-second (Gbps) electrical lanes. And when 200Gbps electrical input-output (I/O) technology is developed, OSFP-XD will become a 3.2-terabit module. 

Directly interfacing with 100Gbps ASIC serialiser/ deserialiser (serdes) lanes means the 1.6-terabit module can support 51.2-terabit single rack unit (1RU) Ethernet switches without needing 200Gbps ASIC serdes required by eight-lane modules like the OSFP.

“You might argue that it [the OSFP-XD] is just postponing what the CW-WDM MSA is doing,” says Cole. “But I’d argue the opposite: if you fundamentally want to solve problems, you have to go parallel.”

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Oclaro showcases its pluggable CFP2-DCO at ECOC

Multi-sourcing CFP2-DCO modules, coherent digital signal processor (DSP) partnerships, new laser opportunities and the latest on Lumentum’s acquisition of Oclaro. A conversation with Oclaro’s chief strategy officer, Yves LeMaitre.

Oclaro demonstrated its CFP2 Digital Coherent Optics (CFP2-DCO) pluggable module working with Acacia Communications’ own CFP2-DCO at the recent European Conference on Optical Communication (ECOC), held in Rome.

Yves LeMaitreOclaro announced earlier this year that it would use Acacia’s Meru coherent DSP for a CFP2-DCO product.

The company also announced at ECOC the availability of a portfolio of single-mode lasers that operate over an extended temperature range.

“We see two new laser opportunities for us,” says LeMaitre. “The upgrade of the access networks and, concurrently, the deployment of 5G.”

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Aurrion mixes datacom and telecom lasers on a wafer

Silicon photonics player, Aurrion, has detailed the making of multiple laser designs for datacom and telecom on a single wafer. The multiple designs on one wafer benefit the economics of telecom lasers by manufacturing them alongside higher-volume datacom sources.

"There is an inevitability of the co-mingling of electronics and optics and we are just at the beginning"

Eric Hall, Aurrion

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