ECOC 2023 industry reflections

Gazettabyte is asking industry figures for their thoughts after attending the recent ECOC show in Glasgow. In particular, what developments and trends they noted, what they learned and what, if anything, surprised them. Here are the first responses from BT, Huawei, and Teramount. 

Andrew Lord, Senior Manager, Optical Networks and Quantum Research at BT

I was hugely privileged to be the Technical Co-Chair of ECOC in Glasgow, Scotland and have been working on the event for over a year. The overriding impression was that the industry is fully functioning again, post-covid, with a bumper crop of submitted papers and a full exhibition. Chairing the conference left little time to indulge in content. I will need to do my regular ECOC using the playback option. But specific themes struck me as interesting.

There were solid sessions and papers around free space optics, including satellite. The activities here are more intense than we would typically see at ECOC. This reflects a growing interest and the specific expertise within the Scottish research community. Similarly, more quantum-related papers demonstrated how quantum is integrating into the mainstream optical industry.

I was impressed by the progress towards 800-gigabit ZR (800ZR) pluggables in the exhibition. This will make for some interesting future design decisions, mainly if these can be used instead of the increasingly ubiquitous 400 gigabit ZR. I am still unclear whether 800-gigabit coherent can hit the required power consumption points for plugging directly into routers. The costs for these plugs, driven by volumes, will have a significant impact.

I also enjoyed a lively and packed rump session debating the invasion of artificial intelligence (AI) into our industry. I believe considerable care is needed, particularly where AI might have a role in network management and optimisation.

Maxim Kuschnerov, Director R&D at Huawei

ECOC usually has fewer major announcements than the OFC show. But ECOC was full of technical progress this time, making the OFC held in March seem a distant memory.

What was already apparent in September at the CIOE in Shenzhen was on full display on the exhibition floor in Glasgow: the linear drive pluggable optics (LPO) trend has swept everyone off their feet. The performance of 100-gigabit native signalling using LPO can not be ignored for single-mode fibre and VCSELs.

Arista gave a technical deep-dive at the Market Focus with a surprising level of detail that went beyond the usual marketing. There was also a complete switch set-up at the Eoptolink booth, and the OIF interop demonstration.

While we must wait for a significant end user to adopt LPO, it begs the question: is this a one-off technological accident or should the industry embrace this trend and have research set its eyes on 200 gigabits per lane? The latter would require a rearchitecting of today's switches, a more powerful digital signal processor (DSP) and likely a new forward error corrections (FEC) scheme, making the weak legacy KP4 for the 224-gigabit serdes in the IEEE 802.3dj look like a poor choice.

There was less emphasis on Ethernet 1.6 terabits per second (Tb/s) interfaces with 8x200G optical lanes. However, the arrival of a second DSP source with better performance was noted at the show.

The module power of 1.6-terabit DR8 modules showed no significant technological improvement compared with 800Gbps DSP-based modules and looked even more out of place when benchmarking against 800G LPO pluggables. Arista drove home that we can't continue increasing the power consumption of the modules at the faceplate despite the 50W QSFP-DD1600 announcement.

The same is true for coherent optics.

Although the demonstration of the first 800ZR live modules was technically impressive, the efficiency of the power per bit hardly improved compared to 400ZR, making the 1600ZR project of OIF look like a tremendous technological challenge.

To explain, a symbol rate of 240 gigabaud (GBd) will drive the optics for 1600ZR. Using 240Gbaud with two levels per symbol to create 16QAM over two dimensions is a 400Gbps net rate or 480Gbps gross rate electrical per lane, albeit very short reach. Coherent has four lanes - 2 polarisations & in-phase and quadrature - to deliver four by 400G or 1.6Tbps. This is like what we have now: 200G on the optical side of 1.6T 8x200G PAM4 and 4x200G on 800ZR, while the electrical (longer reach) host still uses 100 gigabits per lane.

The industry will have to analyse which data centre scenarios direct detection will be able to cover with the same analogue-to-digital & digital-to-analogue converters and how deeply coherent could be driven within the data centre.

ECOC also featured optical access evolution. With the 50G FTTx standard completed with components sampling at the show and products shipping next year, the industry has set its eyes on the next generation of very high-speed PON.

There is some initial agreement on the technological choice for 200 gigabits with a dual-lambda non-return to zero (NRZ) signalling. Much of the industry debate was around the use cases. It is unrealistic to assume that private consumers will continue driving bandwidth demand. Therefore, a stronger focus on 6G wireless fronthaul or enterprise seems a likely scenario for point-to-multi-point technology.

Hesham Taha, CEO of Teramount

Co-packaged optics had renewed vigour in ECOC, thanks partly to the recent announcements of leading foundries and other semiconductor vendors collaborating in silicon photonics.

One crucial issue, though, is that scalable fibre assembly remains an unsolved problem that is getting worse due to the challenging requirements of high-performance systems for AI and high-performance computing. These requirements include a denser "shoreline" with a higher fibre count and a denser fibre pitch, and support for an interposer architecture with different photonic integrated component (PIC) geometries.

Despite customers having different requirements for co-packaged optics fibre assembly, detachable fibres now have wide backing. Having fibre ribbons that can be separated from the co-packaged optics packaging process increases manufacturing yield and reliability. It also allows the costly co-packaged optics-based servers/ switches to be serviced in the field ro replace faulty fibre.

Our company, Teramount, had an ECOC demo showing the availability of such a detachable fibre connector for CPO, dubbed Teraverse.

It is increasingly apparent that the solution for a commercially viable fibre assembly on chip lies with a robust manufacturing ecosystem rather than something tackled by any one system vendor. This fabless model has proven itself in semiconductors and must be extended to silicon photonics. This will allow each part of the production chain - IC designers, foundries, and outsourced semiconductor assembly and test (OSAT) players - to focus on what they do best.