DustPhotonics raises funding for 800G and 1.6T modules

• DustPhotonics has raised $24 million in funding.
• The start-up has taped out its 200 gigabit-per-lane optical chip.
• DustPhotonics expects the 1.6-terabit module market to ramp, starting year-end.

Ronnen Lovinger

DustPhotonics, which develops chips for transmit optical sub-assemblies (TOSAs) for 400 and 800-gigabit pluggable optical modules, has raised $24 million. The funding extends its Series B funding round.

"When you start ramping up products, you have to iron out the creases around supply chain, production, and everything else," says Ronnen Lovinger, CEO of DustPhotonics.

DustPhotonics has several customers and a backlog of orders for its 400 and 800-gigabit photonic integrated circuits (PICs). The company has also taped out its 200 gigabit-per-lane chip and will have products later this year.

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DustPhotonics readies its first optical engine

• DustPhotonics has a silicon photonics modulator capable of 200 gigabits per lane
• The start-up also has developed a precision laser-attach scheme

 DustPhotonics’s office view

Ronnen Lovinger waves as he approaches the local train station. DustPhotonics’ CEO is taking me to the company’s offices on the outskirts of Modi’in, halfway between Tel Aviv and Jerusalem.

The site has a striking view of a landscape also halfway between Israel’s flat coastal plain and the steep hills of Jerusalem.

Lovinger has been CEO of DustPhotonics since 2021. Before that, he was chief operating officer (COO) at Innoviz Technologies, joining the lidar firm after 18 years at Mellanox, now part of Nvidia.

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