Teramount’s scalable fibre-attach for co-packaged optics

Part 2: Co-packaged optics: fibre-attach

Hesham Taha recently returned from a trip to the US to meet with leading vendors and players serving the silicon photonics industry.

“It is important to continue probing the industry,” says Taha, the CEO of start-up Teramount.

Teramount specialises in fibre assembly technology: coupling fibre to silicon photonics chips.

Taha is now back in the US, this time to unveil Teramount’s latest product at this week’s OFC show being held in San Diego. The company is detailing a new version of its fibre assembly technology, dubbed Teraverse-XD, that doubles the density of fibres connected to a silicon photonics chip.

Teramount is also announcing it is working with GlobalFoundries, a leading silicon-photonics foundry.

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Packaging silicon photonics using passive alignment

• An Israeli start-up is tackling a key packaging challenge for silicon photonics

Teramount has developed a way to simplify the packaging of silicon photonics chips. Instead of using active alignment whereby an external laser is required to carefully align a fibre to the optical die, the Israeli start-up has developed a technology that allows passive alignment.  

Hesham Taha“If we want silicon photonics to ramp up to volume, it has to meet CMOS standards both in terms of fabrication and packaging,” says Hesham Taha, Teramount's CEO.

Taha worked at a company developing atomic force microscopy systems before co-founding Teramount. "We got to know of the problem of injecting light into a waveguide and were surprised that the industry was still using active alignment," he says.

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