Tuesday
Mar072017
Stitching together disaggregated chips
Tuesday, March 7, 2017 at 10:26AM The Optical Internetworking Forum (OIF) has begun work on a 112-gigabit electrical interface to connect chips in a multi-chip module.
The ultra-short-reach electrical interface for multi-chip modules adds to the OIF's ongoing CEI-112G project, started in August 2016, to develop a 112 gigabit-per-second (Gbps) serial electrical interface for next-generation optical modules.
Source: Gazettabyte, OIF data. The year 2018 is an estimate.
