Thursday
Sep122013
Terabit interconnect to take hold in the data centre
Thursday, September 12, 2013 at 9:03AM Intel and Corning have further detailed their 1.6 Terabit interface technology for the data centre.
The collaboration combines Intel's silicon photonics technology operating at 25 Gigabit-per-fibre with Corning's ClearCurve LX multimode fibre and latest MXC connector.
Silicon photonics wafer and the ClearCurve fibres. Source: Intel
