Companies gear up to make 800 Gig modules a reality

Nine companies have established a multi-source agreement (MSA) to develop optical specifications for 800-gigabit pluggable modules.

Maxim Kuschnerov

The MSA has been created to address the continual demand for more networking capacity in the data centre, a need that is doubling roughly every two years. The largest switch chips deployed have a 12.8 terabit-per-second (Tbps) switching capacity while 25.6-terabit and 51-terabit devices are in development. 

“The MSA members believe that for 25.6Tbps and 51.2Tbps switching silicon, 800-gigabit interconnects are required to deliver the required footprint and density,” says Maxim Kuschnerov, a spokesperson for the 800G Pluggable MSA.

A 1-rack-unit (1RU) 25.6-terabit switch platform will use 32 such 800-gigabit modules while a 51.2-terabit 2RU platform will require 64.

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Ayar Labs and Intel add optical input-output to an FPGA

Start-up Ayar Labs, working with Intel, has interfaced its TeraPHY optical chiplet to the chip giant’s Stratix10 FPGA.

Hugo SalehIntel has teamed with several partners in addition to Ayar Labs for its FPGA-based silicon-in-package design, part of the US Defense Advanced Research Projects Agency’s (DARPA) project.  

Ayar Labs used the Hot Chips conference, held in Palo Alto, California in August, to detail its first TeraPHY chiplet product and its interface to the high-end FPGA.  

Origins

Ayar Labs was established to commercialise research that originated at MIT. The MIT team worked on integrating both photonics and electronics on a single die without changing the CMOS process.

The start-up has developed such building-block optical components in CMOS as a vertical coupler grating and a micro-ring resonator for modulation, while the electronic circuitry can be used to control and stabilise the ring resonator’s operation.  

Ayar Labs has also developed an external laser source that provides an external light source that can power up to 256 optical channels, each operating at either 16 to 32 gigabits-per-second (Gbps).

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Hyperscaler or ICP?

Several terms are commonly used when referring to leading internet companies, those that operate large-scale data centres and typically are household names.

Terms used include internet content providers (ICP), hyperscalers and mega data centre operators. Meanwhile, a leading system vendor, in a briefing, referred to ‘global content providers’.  

The terms are used interchangeably but, not surprisingly, there are differences.

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Features added around 400ZR aims to bring order to 400ZR+

The OIF has started a project to combine Flexible Ethernet (FlexE) technology with the 400ZR coherent interface standard.

Karl Gass400ZR is designed to transmit a 400 Gigabit Ethernet (GbE) signal over at least 80km using coherent optical transmission.

Adding FlexE technology will enable 4x100GbE signals to also be transmitted.

Separately, the OIF has started a project to create a 96 gigabaud (GBd) coherent driver modulator specification. Such a symbol rate enables 800 gigabits of data to be sent using a single carrier.

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ECI Telecom details its cell-site gateway for 5G

ECI Telecom has unveiled its cell-site router for 5G that also supports existing 3G and 4G wireless standards. 

“You need to support the existing one or two generations of cellular networks,” says Jimmy Mizrahi, ECI’s executive vice president and head of global portfolio.

Jimmy MizrahiThe platform, the NPT 1022 cell-site router, is the first of several platforms that ECI will launch for 5G as it upgrades and expands its Neptune product line.

“The 1022 is part of a new line of products covering all layers of the network, starting at the cell site and going to aggregation and the metro core,” says Ezra Yehezkel, product line manager, packet transport solutions at ECI.

The Neptune portfolio will include a high-capacity packet-processing platform that can scale to 16 terabits. 

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Infinera prepares for first ICE6 coherent DSP samples

Infinera has taped out its 7nm CMOS FlexCoherent 6 digital signal processor (DSP) and expects samples of the coherent chip in the next fortnight.

“We are ready to start fabricating prototype modules,” says Robert Shore, senior vice president of marketing at Infinera (pictured).

The DSP, along with Infinera’s photonic integrated circuit (PIC) that was demonstrated at the OFC show held in March, will be integrated into a module that supports two wavelengths, each capable of supporting up to 800 gigabits of data. 

The company expects to have a prototype of the 1.6-terabit Infinite Coherent Engine 6 (ICE6) module by year-end, while the first ICE6-based products are scheduled for the second half of 2020.

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ADVA runs the rule over its TeraFlex platform

Gazettabyte talks to Jörg-Peter Elbers about the recent trial of ADVA’s FSP 3000 TeraFlex platform in Tele2’s network and gets his views on industry trends.

Herzliya marina. Source: Gazettabyte

It is early morning and the air is cool. I'm seated outside at a coffee bar in Herzliya’s marina awaiting Jörg-Peter Elbers, senior vice president, advanced technology, who is in Israel visiting local ADVA staff.   

He arrives as the bar opens and we are the only customers.

Just as we are about to start, the waitress informs us that the barista has yet to arrive. Breakfast can be ordered but we must wait for coffee. 

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