John Bowers: We are still at the dawn of photonics
After 38 years at the University of California, Santa Barbara (UCSB), Professor John Bowers (pictured) is stepping away from teaching and administrative roles to focus on research.
He welcomes the time it will free for biking and golf. He will also be able to linger, not rush, when travelling. On a recent trip to Saudi Arabia, what would have centered around a day-event became a week-long visit.
Bowers’ career includes significant contributions to laser integration and silicon photonics, mentoring some 85 PhD students, and helping found six start-ups, two of which he was the CEO.
Early Influences
Bowers’ interest in science took root while at high school. He built oscilloscopes and power supplies using Heathkits, then popular educational assemblies for electronics enthusiasts. He was also inspired by his physics and chemistry teachers, subjects he majored in at the University of Minnesota.
A challenging experience led him to focus solely on physics: “I took organic chemistry and hated it,” says Bowers. “I went, ‘Okay, let’s stick to inorganic materials.’”
Bowers became drawn to high-energy physics and worked in a group conducting experiments at Fermilab and Argonne National Laboratories. Late-night shifts – 10 PM to 6 AM – offered hands-on learning, but a turning point came when his mentor was denied tenure. “My white knight fell off his horse,” he says.
He switched to applied physics at Stanford, where he explored gallium arsenide and silicon acoustic devices, working under the supervision of the late Gordon Kino, a leading figure in applied physics and electrical engineering.
Bowers then switched to fibre optics, working in a group that was an early leader in single-mode optical fibre. “It was a period when fibre optics was just taking off,” says Bowers. “In 1978, they did the first 50-megabit transmission system, and OFC [the premier optical fibre conference] was just starting.”
Bell Labs and fibre optics
After gaining his doctorate, Bowers joined Bell Labs, where his work focused on the devices—high-speed lasers and photodetectors—used for fibre transmission. He was part of a team that scaled fibre-optic systems from 2 to 16 gigabits per second. However, the 1984 AT&T breakup signalled funding challenges, with Bell Labs losing two-thirds of its financial support.
Seeking a more stable environment, Bowers joined UCSB in 1987. He was attracted by its expertise in semiconductors and lasers, including the presence of the late Herbert Kroemer, who went on to win the 2000 Nobel Prize in Physics. Kroemer developed the double heterostructure laser and played a big part in enticing Bowers to join. Bowers was tasked with continuing the laser work, something he has done for the last 40 years.
“Coming to Santa Barbara was brilliant, in retrospect,” says Bowers, citing its strong collaborative culture and a then newly formed materials department.
Integrated lasers
At UCSB, Bowers worked on integrated circuits using indium phosphide, including tunable lasers and 3D stacking of photonic devices.
At the same time, the field of silicon photonics was starting after Richard Soref wrote a seminal paper proposing silicon as an optical material for photonic integrated circuits (PIC).
“We all knew that silicon was a terrible light emitter because it is an indirect band-gap material,” says Bowers. “So when people started talking about silicon photonics, I kept thinking: ‘Well, that is fine, but you need a light source, and if you don’t have a light source, it’ll never become important.’”
Bowers tackled integrating lasers onto silicon to address the critical need for an on-chip light source. He partnered with Intel’s Mario Paniccia and his team, which had made tremendous progress developing a silicon Raman lasers with higher powers and narrower linewidths.
“It was very exciting, but you still needed a pump laser; a Raman laser is just a wavelength converter from one wavelength to another,” says Bowers. “So I focused on the pump laser end, and the collaboration benefitted us both.”
Intel commercialised the resulting integrated laser design and sold millions of silicon-photonics-based pluggable transceivers.
“Our original vision was verified: the idea that if you have CMOS processing, the yields will be better, the performance will be better, the cost will be lower, and it scales a lot better,” says Bowers. “All that has proven to be true.
Is Bowers surprised that integrated laser designs are not more widespread?
All the big silicon photonics companies, including foundry TSMC, will incorporate lasers into their products, he says, just as Intel has done and Infinera before that.
Infinera, an indium phosphide photonic integrated circuit (PIC) company now acquired by Nokia, claimed that integration would improve the reliability and lower the cost, says Bowers: “Infinera did prove that with indium phosphide and Intel did the same thing for silicon.”
The indium phosphide transceiver has a typical failure rate of 10 FIT (failures per ten billion hours), and if there are 10 laser devices, the FIT rises to 100, he says. By contrast, Intel’s design has a FIT of 0.1, and so with 10, the FIT becomes on the order of 1.
Silicon lasers are more reliable because there’s no III-V material exposed anywhere. Silicon or silicon dioxide facets eliminate the standard degradation mechanisms in III-V materials. This enables non-hermetic packaging, reducing costs and enabling rapid scaling.
According to Bowers, Intel scaled to a million transceivers in one year. Such rapid scaling to high volumes is important for many applications, and that is where silicon photonics has an advantage.
“Different things motivate different people. For me, it’s not about money, it’s more about your impact, particularly on students and research fields. To the extent that I’ve contributed to silicon photonics becoming important and dynamic, that is something I’m proud of.”
-Professor John Bowers
Optical device trends
Bowers notes how the rise of AI has surprised everyone, not just in terms of the number of accelerator chips needed but their input-output (I/O) requirements.
Copper has been the main transmission medium since the beginning of semiconductor chips, but that is now being displaced by optics – silicon photonics in particular – for the communications needs of very high bandwidth chips. He also cites companies like Broadcom and Nvidia shipping co-packaged optics (CPO) for their switching chips and platforms.
“Optics is the only economic way to proceed, you have to work on 3D stacking of chips coupled with modern packaging techniques,” he says, adding that the need for high yield and high reliability has been driving the work on III-V lasers on silicon.
One current research focus for Bowers is quantum dot lasers, which reduce the line width and minimise reflection sensitivity by 40dB. This eliminates the need for costly isolators in datacom transceivers.
Quantum dot devices also show exceptional durability, with lifetimes for epitaxial lasers on silicon a million times longer than quantum well devices on silicon and 10 times less sensitivity to radiation damage, as shown in a recent Sandia National Labs study for space applications.
Another area of interest is modulators for silicon photonics. Bowers says his group is working on sending data at 400 gigabits-per-wavelength using ‘slow light’ modulators. These optical devices modulate the intensity or phase, of light. Slowing down the light improves its interaction in the material, improving efficiency and reducing device size and capacitance. He sees such modulators is an important innovation.
“Those innovations will keep happening; we’re not limited in terms of speed by the modulator,” says Bowers, who also notes the progress in thin-film lithium niobate modulators, which he sees as benefiting silicon photonics, “We have written papers suggesting most of the devices may be III-V,” says Bowers, and the same applies to materials such as thin-film lithium niobate.
“I believe that as photonic systems become more complex, with more lasers and amplifiers, then everyone will be forced to integrate,” says Bowers.
Other applications
Beyond datacom, Bowers sees silicon photonics enabling LIDAR, medical sensors, and optical clocks. His work on low-noise lasers, coupled to silicon nitride waveguides, reduces phase noise by 60dB, enhancing sensor sensitivity. “If you can reduce the frequency noise by 60dB, then that makes it either 60dB more efficient, or you need 60dB less power,” he says.
Applications include frequency-based sensors for gas detection, rotation sensing, and navigation, where resonance frequency shifts detect environmental changes.
Other emerging applications include optical clocks for precise timing in navigation, replacing quartz oscillators. “You can now make very quiet clocks, and at some point we can integrate all the elements,” Bowers says, envisioning chip-scale solutions.
Mentorship and entrepreneurial contributions
Bowers’ impact extends to mentorship, guiding so many PhD students who have gone on to achieve great success.
“It’s very gratifying to see that progression from an incoming student who doesn’t know what an oscilloscope is to someone who’s running a group of 500 people,” he says.
Alan Liu, former student and now CEO of the quantum dot photonics start-up Quintessent, talks about how Bowers calls on his students to ‘change the world’.
Liu says it is not just about pushing the frontiers of science but also about having a tangible impact on society through technology and entrepreneurship.”
Bowers co-founded UCSB’s Technology Management Department and taught entrepreneurship for 30 years. Drawing on mentors like Milton Chang, he focused on common start-up pitfalls: “Most companies fail for the same set of reasons.”
His own CEO start-up experience informed his teaching, highlighting interdisciplinary skills and team dynamics.
Mario Paniccia, CEO of Anello Photonics, who collaborated with Bowers as part of the Intel integrated laser work, highlights Bowers’ entrepreneurial skills.
“John is one of the few professors who are not only brilliant and technically a world expert – in John’s case, in III-V materials – but also business savvy and entrepreneurial,” says Paniccia. “He is not afraid to take risks and can pick and hire the best.”
Photonics’ future roadmap
Bowers compares photonics’ trajectory to electronics in the 1970s, when competing CMOS technologies standardised, shifting designers’ focus from device development to complex circuits. “Just like in the 1970s, there were 10 competing transistor technologies; the same consolidation will happen in photonics,” he says.
Standardised photonic components will be integrated into process design kits (PDKs), redirecting research toward systems like sensors and optical clocks.
“We’re not at the end, we’re at the beginning of photonics,” emphasises Bowers.
Reflections
Looking back, would he have done anything differently?
A prolonged pause follows: “I’ve been very happy with the choices I have made,” says Bowers, grateful for his time at UCSB and his role in advancing silicon photonics.
Meanwhile, Bowers’ appetite for photonics remains unwavering: “The need for photonic communication, getting down to the chip level, is just going to keep exploding,” he says.
Heterogeneous integration comes of age
Silicon photonics luminaries series
Interview 7: Professor John Bowers
August has been a notable month for John Bowers.
Juniper Networks announced its intention to acquire Aurrion, the US silicon photonics start-up that Bowers co-founded with Alexander Fang. And Intel, a company Bowers worked with on a hybrid integration laser-bonding technique, unveiled its first 100-gigabit silicon photonics transceivers.
Professor John BowersBower, a professor in the Department of Electrical and Computer Engineering at the University of California, Santa Barbara (UCSB), first started working in photonics in 1981 while at AT&T Bell Labs.
When he became interested in silicon photonics, it still lacked a good modulator and laser. "If you don't have a laser and a modulator, or a directly modulated laser, it is not a very interesting chip,” says Bowers. "So I started thinking how to do that."
Bowers contacted Mario Paniccia, who headed Intel’s silicon photonics programme at the time, and said: “What if we can integrate a laser? I think there is a good way to do it.” The resulting approach, known as heterogeneous integration, is one that both Intel and Aurrion embraced and since developed.
This is a key Bowers trait, says Aurrion co-founder, Fang: he just knows what problems to work on.
"John came up with the concept of the hybrid laser very early on," says Fang. "Recall that, at that time, silicon photonics was viewed as nothing more than people making plasma-effect phase shifters and simple passive devices. John just cut to the chase and went after combining III-V materials with silicon."
If you look at the major companies with strong photonics activities, you’ll find a leader in that group that was developed under John’s training
Fang also highlights Bowers' management skills. “John can pick players and run teams,” says Fang, who describes himself as one of those privileged to graduate out of Bowers’ research group at UCSB.
“You find yourself in an environment where John picks a team of sharp folk with complementary skills and domain expertise to solve a problem that John determines as important and has some insight on how to solve it,” says Fang. “If we look like we are going to drive off the road, he nudges with a good mix of insight, fear, and humour.”
It has resulted in some of the best trained independent thinkers and leaders in the industry, says Fang: “If you look at the major companies with strong photonics activities, you’ll find a leader in that group that was developed under John’s training”.
Silicon photonics
Bowers defines silicon photonics as photonic devices on a silicon substrate fabricated in a CMOS facility.
“Silicon photonics is not about using silicon for everything; that misses the point,” says Bowers. “The key element is using silicon as a substrate - 12-inch wafers and not 2- or 3-inch wafers - and having all the process capability a modern silicon CMOS facility brings.” These capabilities include not just wafer processing but also advanced testing and packaging.
The world is about to change and I don't think people have quite figured that out
“If you go to an advanced packaging house, they don't do 6-inch wafers and I don't know of indium phosphide and gallium arsenide wafers larger than 6 inches,” says Bowers. “The only solution is to go to silicon; that is the revolution that hasn't happened yet but it is happening now.”
Bowers adds that everything Aurrion does, there is automated test along the way. "And I think you have others; Luxtera has done a great job as well at wafer-level test and packaging," he says. "The world is about to change and I don't think people have quite figured that out."
Working with Intel was an eye-opener for Bowers, especially the process controls it applies to chip-making.
“They worry about distributions and yields, and it is clear why there are seven billion transistors on a chip and that chip will yield,” says Bowers. “When you apply that to photonics, it will take it to a whole new level.” Indeed, Bowers foresees photonics transfering to silicon.
Bowers highlights the fairly complex chips now being developed using silicon photonics.
“We have done a 2D scanner - a 32-element phased array - something one could never do in optics unless it was integrated all on one chip,” he says. The phased-array chip comprises 160 elements and is physically quite large.
This is another benefit of using 12-inch silicon wafers and fabricating the circuits in a CMOS facility. “You are not going to cost-effectively do that in indium phosphide, which I've worked on for the last 30 years,” says Bowers.
Another complex device developed at UCSB is a 2.54-terabit network-on-a-chip. “This is a larger capacity than anyone has done on any substrate,” he says.
Infinera’s latest photonic integrated circuit (PIC), for example, has a transport capacity of up to 2.4 terabit-per-second. That said, Bowers stresses that the network-on-a-chip is a research presentation while Infinera’s PIC is a commercial device.
Heterogeneous integration
Heterogeneous integration involves bonding materials such as III-V compounds onto silicon.
Bowers first worked on III-V bonding with HP to make longer wavelength - 1310nm and 1550nm - VCSELs. “We had been bonding indium phosphide and gallium arsenide to solve a fundamental problem that indium phosphide does not make good mirrors,” he says. “So I was pretty confident we could bond III-V to silicon to add gain to silicon photonics to then add all the laser capability.”
Bonding to silicon is attractive as it enables the integration of optical features that haven't been widely integrated onto any other platform, says Bowers. These include not only lasers but other active devices such as modulators and photo-detectors, as well as passive functions such as isolators and circulators.
One concern raised about heterogeneous integration and the use of III-V materials is the risk of contamination of a CMOS fabrication line.
Bowers points out that the approached used does not impact the front end of the fabrication, where silicon wafers are etched and waveguides formed. The III-V material is bonded to the wafer at the fab’s back end, the stage where metallisation occurs when making a CMOS chip.
The leading chipmakers are also experimenting with III-V materials to create faster digital devices due to their higher electron mobility. “This is part of the natural evolution of CMOS,” he says. It remains unclear if this will be adopted, but it is possible that a 5nm CMOS node will use indium phosphide.
“All the CMOS houses are doing lots of work on III-V and silicon,” says Bowers. “They have figured out how to control that contamination issue.”
New capabilities
Bowers and his team have already demonstrated the integration of new optical functions on silicon.
“Neither silicon nor indium phosphide has an isolator and one always has to use an external YIG (yttrium iron garnet) isolator to reduce the reflection sensitivity of things like widely tunable lasers,” says Bower.
His team has developed a way to bond a YIG onto silicon using the same techniques it uses for bonding III-V materials. The result is an integrated isolator device with 32dB isolation and a 2dB insertion loss, a level of performance matching those of discrete isolators.
Incorporating such functionality onto silicon creates new possibilities. “We have a paper coming out that features a 6-port circulator,” says Bowers. “It is not a tool that the community can use yet because it has never been made before but we can do that on silicon now,” he says. “That is a good new capability.”
Superior performance
Bowers stresses that heterogeneous integration can also result in optical performance superior to a III-V design alone. He cites as an example how using a silicon nitride waveguide, with its lower loss that indium phosphide or gallium arsenide, can create high-quality Q-resonators.
A Q-resonator can be viewed as a form of filter. Bowers' group have demonstrated one with a Q of 80 million. “That makes it very sensitive to a variety of things,” he says. One example is for sensors, using a Q resonator with a laser and detector to form a spectrometer.
His researchers have also integrated the Q resonator with a laser to make a widely tunable device that has a very narrow line-width: some 40kHz wide. This is a narrower than the line-width of commercially-available tunable lasers and exceeds what can be done with indium phosphide alone, he says.
Challenges
Bowers, like other silicon photonics luminaries, highlights the issues of automated packaging and automated testing, as important challenges facing silicon photonics. “Taking 10,000s of transceivers and bringing all the advanced technology - not just processing but test and packaging - that are being developed for cell phones,” he says.
Too much of photonics today is based on gold boxes and expensive transceivers. “Where Aurrion and Intel are going is getting silicon photonics to the point where photonics will be ubiquitous, cheap and high yielding,” he says. This trend is even evident with his university work. The 400-element 2.54-terabit network-on-a-chip has very high laser yields, as are its passive yields, he says.
“So, effectively, what silicon photonics can do is going up very rapidly,“ says Bowers. “If you can put it in the hands of a real CMOS player like Intel or the companies that Aurrion uses, it is going to take photonics to a whole new area that people would not have thought possible in terms of complexity.”
Yet Bowers is also pragmatic. “It still takes time,” he says. “You can demonstrate an idea, but it takes time to make it viable commercially.”
He points to the recently announced switch from Oracle that uses mid-board optics. “That is a commercial product out there now,” he says. “But is it silicon photonics? No, it is VCSEL-based; that is the battle going on now.”
VCSELs have won the initial battle in the data centre but the amount of integration the technology can support is limited. Once designers move to wavelength-division multiplexing to get to higher capacities, where planar technology is required to combine and separate the different wavelengths efficiently, that is when silicon has an advantage, he says.
The battle at 100 gigabit between VCSELs and silicon photonics is also one that Bowers believes silicon photonics will eventually win. But at 400 gigabit and one terabit, there is no way to do that using VCSELs, he says.
Status
The real win for silicon photonics is when optics moves from transceivers at the edge of the board to mid-board and eventually are integrated with a chip in the same package, he says.
Advanced chips such as switch silicon for the data centre are running into an input-output problem. There are only so many 25 gigabit-per-second signals a chip can support. Each signal, sent down a trace on a printed circuit board, typically requires equalisation circuitry at each end and that consumes power.
Most of the photonics industry has focused on telecom and datacom, and justifiably so. The next big thing will happen in the area of sensors.
A large IC packaged as a ball grid array may have as many as 5,000 bumps (balls) that are interfaced to the printed circuit board. Using photonics can boost the overall bandwidth coming on and off the chip.
“With photonics, and in particular when we integrate the laser as well as the modulator, the world doesn't see it as a photonics chip, it's an electronics chip, it just turns out that some of those bumps are optical ones and they provide much more efficient transmission of data and at much lower power,” say Bowers. A 100 terabit of even a 1000 terabit - a petabit - switch chip then becomes possible. This is not possible electrically but it is possible by integrating photonics inside the package or on the chip itself, he says.
“That is the big win eventually and that is where we help electronics extend Moore’s law,” says Bowers.
And as silicon photonics matures, other applications will emerge - More than Moore’s law - like the use of photonics for sensors.
“Most of the photonics industry has focused on telecom and datacom, and justifiably so,” says Bowers. “The next big thing will happen in the area of sensors.”
Professor Bowers was interviewed before the Juniper Networks announcement