Ranovus outlines its co-packaged optics plans

Part 2: Odin technology

Ranovus has tested a chiplet that combines electronics and silicon photonics. Dubbed Odin 8, the monolithic design is targetting the co-packaged optics opportunity, enabling silicon chips to communicate optically.

The company is developing two such chiplets: the 800-gigabit Odin 8 and the higher-capacity Odin 32 that supports 3.2 terabits of traffic. 

Hamid Arabzadeh 

The first use of Odin 8 will be for 800-gigabit client-side modules. “We already have three lead customers for our 800-gigabit module business,” says Hamid Arabzadeh, CEO of Ranovus.

The 800-gigabit pluggable modules using the Odin 8 are expected to be generally available from late 2021.

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Inphi unveils first 800-gigabit PAM-4 signal processing chip

Inphi has detailed what it claims is the industry’s first digital signal processor (DSP) chip family for 800-gigabit client-side pluggable modules. 

Dubbed Spica, the 4-level pulse-amplitude modulation (PAM-4) DSP family is sampling and is in the hands of customers.

Source: Inphi

The physical-layer company has also announced its third-generation Porrima family of PAM-4 DSPs for 400-gigabit pluggables. 

The Porrima DSP with integrated laser driver has being made using a 7nm CMOS process; until now a 16nm CMOS has been used. Fabricating the chip using the more advanced process will reduce the power consumption of 400-gigabit module designs. 

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Optical supply chain set to withstand the COVID-19 crisis

The optical supply chain will not experience any lasting damage as a result of the COVID-19 pandemic. So argues LightCounting in a research note.   

John LivelyThe market research company notes how the experience of the Coronavirus pandemic has highlighted the many benefits of the digital economy.

And the jolt the world is experiencing will if anything, strengthen it.

“All kind of things are happening as a result of the pandemic,” says John Lively, principal analyst at LightCounting and author of the research note. “Telecommuting, telelearning and telemedicine have all been used before, but never on a scale like this.”  

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