Gazettabyte has been asking industry figures to reflect on the recent ECOC show in Glasgow. The final instalment emphasises coherent technology with contributions from Adtran, Cignal AI, Infinera, Ciena, and Acacia.
The popular Market Focus sessions at ECOC
Jörg-Peter Elbers, head of advanced technology at Adtran
The ECOC 2023 conference and show was a great event. The exhibition floor was busy and offered ample networking opportunities. In turn, the conference and the Market Focus sessions provided information on the latest technologies, products, and developments.
One hot topic was coherent 800ZR modems. Several vendors demonstrated coherent 800ZR modules and related components. Importantly, these modules also boast new and improved 400 gigabit-per-second (Gbps) modes. The 120 gigabaud (GBd) symbol rate enables 400-gigabit dual-polarisation quadrature phase shift keying (DP-QPSK) transmission over demanding links and long-haul routes. In turn, the advent of 5nm CMOS digital signal processor (DSP) technology enables lower power DP-16QAM than 400ZR modules.
There is broad agreement that the next step in coherent transmission is a 240GBd symbol rate, paving the way to single-wavelength 1.6 terabit-per-second (Tbps) optical transport.
Meanwhile, the use of coherent optical technology closer to the network edge continues. Several players announced plans to follow Adtran and Coherent and jump on the low-power 100 gigabit-per-second ZR (100ZR) 'coherent lite' bandwagon. Whether passive optical networking (PON) systems will adopt coherent technology after 50G-PON sparked lively debate but no definitive conclusions.
The OIF 400ZR+ demonstration showed interoperability between a dozen optical module vendors over metro-regional distances. It also highlighted the crucial role of an intelligent optical line system such as Adtran's FSP3000 OLS in automating operation and optimising transmission performance.
The post-deadline papers detailed fibre capacity records by combining multiple spectral bands and multiple fibre cores. The line-system discussions on the show floor focused on the practical implications of supporting C-, L-, extended, and combined band solutions for customers and markets.
From workshops to the regular sessions, the application of artificial intelligence (AI) was another prominent theme, with network automation a focus area. Examples show not only how discriminative AI can detect anomalies or analyse failures but also how generative AI can improve the interpretation of textual information and simplify human-machine and intent interfaces. For network engineers, 'Copilot'-like AI assistance is close.
After ECOC is also before ECOC, so please mark in your calendars September 22-26, 2024. ECOC will celebrate its 50th anniversary next year and will take place in Frankfurt, Germany. As one of the General Chairs of the ECOC 2024 event, and on behalf of the entire organising committee, I look forward to welcoming you!
Andrew Schmitt, founder and directing analyst, Cignal AI
ECOC is a great show, it's like OFC (the annual optical communications and networking event held in the US) but refined to only the critical elements. Here are my key takeaways.
The most impressive demonstration was 800ZR test boards and modules from Marvell and its partners Coherent and Lumentum. Within eight weeks of the first silicon, Marvell has demos up and running in-house and at its partners. The company has at least a 6-month lead in the 800ZR market, making intelligent tradeoffs to achieve this.
Lumentum showed an 8-QAM mode of operation that allows 800 gigabit transmission within a 100GHz channel spacing, which should be interesting. After the massive success of 400ZR, it's natural to extrapolate the same success for 800ZR, but the use cases for this technology are substantially different. We also heard updates and broader support for 100ZR.
Linear drive pluggable optics (LPO) was a hot topic, although it was our impression that, while optimism ruled public discussion, scepticism was widely expressed in private. There was more agreement than disagreement with our recent report (see the Active Insight: The Linear Drive Market Opportunity). No one is more confident about LPO than the companies who view this as another opportunity to bid for business at hyperscale operators they don't currently have.
The 200 gigabit per lane silicon/ physical media device (PMD)/ optics development continues, and it is on track to enable 1.6-terabit optics by 2024. Marvell had a more advanced and mature demo of what they showed behind closed doors at OFC. The advancements here are the real threat to adopting LPO, and people need to realise that LPO is competing with the power specs of 200 gigabits per lane, not 100 gigabits per lane solutions.
Also impressive was the comprehensive engineering effort by Eoptolink to show products that covered 100 gigabit and 200 gigabit per lane solutions, both retimed and linear. The company's actions show that if you have the engineering resources and capital, rather than pick the winning technology, do everything and let the market decide. Also impressive is the CEO, who understood the demos and the seasoned application engineers. Kudos to keeping engaged with the products!
System vendors had a more significant presence at the show, particularly Ciena and Infinera. It's unsurprising to see more system vendors since they are increasing investments in pluggables, particularly coherent pluggables.
We had many discussions about our forecasts for IPoDWDM deployment growth. This disruption is something that component vendors are excited about, and hardware OEMs view it as an opportunity to adjust how they deliver value to operators (see the Active Insight: Assessing the Impact of IP-over DWDM).
Lastly, the OIF coordinated 400ZR+ and OpenROADM interoperability testing despite the organisation not being directly involved in those industry agreements. The OIF is a fantastic organisation that gets valuable things done that its members need.
Paul Momtahan, director, solutions marketing, Infinera
ECOC 2023 provided an excellent opportunity to catch the latest trends regarding transponder innovation, coherent pluggables and optical line systems. A bonus was getting to the show without needing a passport.
Transponder innovation topics included coherent digital signal processor (DSP) evolution, novel modulators, and the maximum possible baud rate. DSP sessions included the possibility of offloading DSP functions into the photonic domain to reduce power consumption and latency.
There were also multiple presentations on constellation shaping, including enhanced nonlinear performance, reduced power consumption for probabilistic constellation shaping, and potential uses for geometric shaping.
Novel modulators with very high baud rates, including thin-film lithium niobate, barium titanate, plasmonic, and silicon-organic hybrid, were covered. The need for such modulators is the limited bandwidth potential of silicon photonics modulators, though each face challenges such as integration with silicon photonics and manufacturability.
From the baud rate session, the consensus was that 400GBd symbol rates are probable, up to 500GBd might be possible, but higher rates are unlikely. The critical challenges are the radio frequency (RF) interconnects and the digital-to-analogue and analogue-to-digital converters. However, several presenters wondered whether a multi-wavelength transponder might be more sensible for symbol rates above 200 to 250GBd.
Coherent pluggables were another topic, especially at 800 gigabit. However, one controversial topic was the longevity of coherent pluggables in routers (IPoDWDM). Several presenters argued the current period would pass once router port speeds and coherent port speeds no longer align.
As the coherent optical engines approach the Shannon limit, innovation is shifting towards optical line systems and fibres as alternative way to scale capacity.
Several presentations covered ROADM evolution to 64 degrees and even 128 degrees. A contrasting view is that ROADMs' days are numbered to be replaced by fibre switches and full spectrum transponders, at least in core networks.
Additional options for scaling capacity included increasing the spectrum of existing bands with super-C and super-L. Lighting different bands, such as the S-band (in addition to C+L bands), is seen as the best candidate, with commercial solutions three to five years away.
Overall, it was a great event, and I look forward to seeing how things evolve by the time of next year's ECOC show in Frankfurt. (For more, click here)
Helen Xenos, senior director, portfolio marketing, Ciena
This was my third year attending ECOC, and the show never disappoints. I always leave this event excited and energised about what we've accomplished as an industry.
Every year seems to bring new applications and considerations for coherent optical technology. This year, ECOC showcased the ever-growing multi-vendor ecosystem for 400-gigabit coherent pluggable transceivers, considerations in the evolution to 800-gigabit pluggables, evolution to coherent PON, quantum-secure coherent networking, and the evolution to 200 gigabaud and beyond. When will coherent technology make it into the data centre? A question still open for debate.
Ciena's optical engineer wizards were on hand to share specifics about our recently announced 3nm CMOS-based WaveLogic 6 technology, which includes the industry's first performance-optimised 1.6 teraburs-per-second (Tbps) optics as well as 800-gigabit pluggables.
It was exciting for me to introduce customers, suppliers and research graduates to their first view of 3nm chip performance results and show how these enable the next generation of products. And, of course, Ciena was thrilled that WaveLogic 6 was awarded the Most Innovative Coherent Module Product at the event.
Tom Williams, director of technical marketing at Acacia
From my perspective, while there weren't as many major product announcements as OFC, several trends and technologies continued to progress, including OIF interoperability, 800ZR/ZR+, linear pluggable optics (LPO) and terabit optics.
The OIF interop demonstration was once again a highlight of the show. The booth was at the entrance to the exhibition and seemed to be packed with people each time I passed by.
OIF has expanded the scope of these demonstrations with each show, and this year was the largest ever. In addition to having the participation of 12 module vendors (with 34 modules), the focus was on the ZR+ operation. What was successfully demonstrated was a single-span 400ZR network and a multi-span network.
The hidden spools of fibre used for the OIF coherent 400ZR+ interoperability demo.
As co-chair of the OpenZR+ MSA, I was excited by the great collaboration with OIF. These efforts help to drive the industry forward. Karl Gass is not only the most creatively dressed person at every trade show; he is exceptional at coordinating these activities.
It is clear that linear drive pluggable optics (LPO) works in some situations, but views differ about how widespread its adoption will be and how standardisation should be addressed. I lived through the analogue coherent optics (ACO) experience. ACO was essentially a linear interface for a coherent module where the digital processing happened outside the module. For ACO, it was a DSP on the host board and for LPO it is the switch ASIC. The parameters that need to be specified are similar. There is a precedent for this kind of effort. Hopefully, lessons learned there will be helpful for those driving LPO. I am interested to see how this discussion progresses in the industry as some of the challenges are discussed, such as its current limited interoperability and support for 200 gigabits per lane.
There have been announcements from several companies about performance-optimised coherent optics in what we call Class 3 (symbol rates around 140 gigabaud), which support up to 1.2 terabits on a wavelength. Our CIM 8 module has been used in multiple field trials, demonstrating the performance benefits of these solutions.
Our CIM 8 (Coherent Interconnect Module 8) achieves this performance in a pluggable form factor. The CIM 8 uses the same 3D siliconisation technology we introduced for our 400-gigabit pluggables and enables operators to scale their network capacity in a cost- and power-efficient way.