- Intel is working with several universities to create building-block circuits to address its optical input-output (I/O) needs for the next decade-plus.
- By 2024 the company wants to demonstrate the technologies achieving 4 terabits-per-second (Tbps) over a fibre at 0.25 picojoules-per-bit (pJ/b).
Intel has teamed up with seven universities to address the optical I/0 needs for several generations of upcoming products.
The initiative, dubbed the Intel Research Center for Integrated Photonics for Data Centre Interconnects, began six months ago and is a three-year project.
No new location is involved, rather the research centre is virtual with Intel funding the research. By setting up the centre, Intel’s goal is to foster collaboration between the research groups.
Motivation
James Jaussi, senior principal engineer and director of the PHY Research Lab in Intel Labs, (pictured) heads a research team that focuses on chip-to-chip communication involving electrical and optical interfaces.
“My team is primarily focussed on optical communications, taking that technology and bringing it close to high-value silicon,” says Jaussi.
Much of Jaussi’s 20 years at Intel has focussed on electrical I/O. During that time, the end of electrical interfaces has repeatedly been predicted. But copper’s demise has proved overly pessimistic, he says, given the advances made in packaging and printed circuit board (PCB) materials.
But now the limits of copper’s bandwidth and reach are evident and Intel’s research arm wants to ensure that when the transition to optical occurs, the technology has longevity.
“This initiative intends to prolong the [optical I/O] technology so that it has multiple generations of scalability,” says Jaussi. And by a generation, Jaussi means the 3-4 years it takes typically to double the bandwidth of an I/O specification.
Co-packaged optics and optical I/O
Jaussi distinguishes between co-packaged optics and optical I/O.
He describes co-packaged optics as surrounding a switch chip with optics. Given the importance of switch chips in the data centre, it is key to maintain compatibility with specifications, primarily Ethernet.
But that impacts the power consumption of co-packaged optics. “The power envelope you are going to target for co-packaged optics is not necessarily going to meet the needs of what we refer to as optical I/O,” says Jaussi.
Optical I/O involves bringing the optics closer to ICs such as CPUs and graphics processor units (GPUs). Here, the optical I/O need not be aligned with standards.
The aim is to take the core I/O off a CPU or GPU and replace it with optical I/O, says Jaussi.
With optical I/O, non-return-to-zero (NRZ) signalling can be used rather than 4-level pulse amplitude modulation (PAM-4). The data rates are slower using NRZ but multiple optical wavelengths can be used in parallel. “You can power-optimise more efficiently,” says Jaussi.
Ultimately, co-packaged optics and optical I/O will become “stitched together” in some way, he says.
Research directions
One of the research projects involves the work of Professor John Bowers and his team at the University of California, Santa Barbara, on the heterogeneous integration of next-generation lasers based on quantum-dot technology.
Intel’s silicon photonics transceiver products use hybrid silicon quantum well lasers from an earlier collaboration with Professor Bowers.
The research centre work is to enable scalability by using multi-wavelength designs as well as enhancing the laser’s temperature performance to above 100oC. This greater resilience to temperature helps the laser’s integration alongside high-performance silicon.
Another project, that of Professor Arka Majumdar at the University of Washington, is to develop non-volatile reconfigurable optical switching using silicon photonics.
“We view this as a core building block, a capability,” says Jaussi. The switching element will have a low optical loss and will require liitle energy for its control.
The switch being developed is not meant to be a system but an elemental building block, analogous to a transistor, Intel says, with the research exploring the materials needed to make such a device.
The work of Professor S.J. Ben Yoo at University of California, Davis, is another of the projects.
His team is developing a silicon photonics-based modulator and a photodetector technology to enable 40-terabit transceivers at 150fJ/bit and achieving 16Tb/s/mm I/O density.
“The intent is to show over a few fibres a massive amount of bandwidth,” says Jaussi.
Goals
Intel says each research group has its own research targets that will be tracked.
All the device developments will be needed to enable the building of something far more sophisticated in future, says Jaussi.
At Intel Labs’ day last year, the company spoke about achieving 1Tbps of I/O at 1pJ/s. The research centre’s goals are more ambitious: 4Tbps over a fibre at 0.25pJ/b in the coming three years.
There will be prototype demonstrations showing data transmissions over a fibre or even several fibres. “This will allow us to make that scalable not just for one but two, four, 10, 20, 100 fibres,” he says. “That is where that parallel scalability will come from.”
Intel says it will be years before this technology is used for products but the research goals are aggressive and will set the company’s optical I/O goals.