Huawei has joined imec, the Belgium nano-electronics research centre, to develop optical interconnect using silicon photonics technology. The strategic agreement follows Huawei's 2013 acquisition of former imec silicon photonics spin-off, Caliopa.
Source: Gazettabyte
“Having acquired cutting-edge expertise in the field of silicon photonics thanks to our acquisition of Caliopa last year, this partnership with imec is the logical next move towards next-generation optical communication,” says Hudson Liu, CEO at Huawei Belgium.
Imec's research focus is to develop technologies that are three to five years away from production. "Imec works with leading IC manufacturers and fabless companies in the field of CMOS fabrication," says Philippe Absil, department director for 3D and optical technologies at imec. "One of the programmes with our co-partners is about optical interconnect and silicon photonics, and Huawei is one of the participating companies."
Imec's research concentrates on board-to-board and chip-to-chip interconnect. The optical interconnect work includes increasing interface bandwidth density, reducing power consumption, and achieving thermal stability and system-cost reduction.
The research centre has demonstrated high-bandwidth interfaces as part of work with Chiral Photonics that makes multi-core fibre. Imec has developed a 2D ring of grating couplers that allow coupling between the silicon photonics chip and Chiral's 61-core fibre. "A grating coupler is a sub-wavelength structure that diffracts the light from a waveguide in a vertical direction towards the fibre above the chip," says Absil. This contrasts to traditional edge coupling to a device, achieved by dicing or cleaving a facet on the waveguide, he says.
Another research focus is how to reduce device power consumption and achieve thermal stability. One silicon photonics component that dictates the overall power consumption is the modulator, says Absil. "The Mach-Zehnder modulator is known to consume significant amounts of power for chip-to-chip distances," he says. "The alternative is to use resonating-based modulators but these have to be thermally controlled, and that has an associated power consumption."
Imec is looking at ways to reduce the thermal control needed and is investigating the addition of materials to silicon to create resonator modulators that do away with the need for heating.
The system-cost reduction work looks at packaging. "Eventually, we want to get the optical transceiver inside a host IC," says Absil. "That package has to enable an optical pass-through, whether it is fibre or an optically-transparent package." Such a requirement differs from established CMOS packaging technology. "The programme is also looking to explore new types of packaging for enabling this optical pass-through," he says.
Absil says certain programme elements are two years away from being completed. "In the programme, we have topics that are closer to being adopted and some that are further away, maybe even to 2020."
Multi-project wafer service
Imec is part of the a consortium of EC research institutes that provide low-cost access to companies that don't have the means to manufacture their own silicon photonics designs. Known as Essential, the EC's Seventh Framework (FP7) programme is an extension of the ePIXfab silicon photonics multi-project wafer initiative. "Imec is offering one flavour of the technology, Leti is also offering a flavour, and then there is IHP and VTT," says Absil. Once the Essential FP7 project is completed, the service will be continued by the Europractice IC service.
Has imec seen any growth now that the funding for OpSIS, the multi-project wafer provider, has come to an end? "We see decent contributions but I wouldn't say it is exponential growth," says Absil, who notes that the A*STAR Institute of Microelectronics in Singapore that OpSIS used continues to offer a multi-project wafer service.
Status of silicon photonics
Despite announcements from Acacia and Intel, and Finisar revealing at ECOC '14 that it is now active in silicon photonics, 2014 has been a quiet year for the technology.
"Right now it is a bit quiet because companies are investing in development," says Absil. "There is not so much incentive to publish this work." Another factor he cites for the limited news is that there are vertically-integrated vendors that are putting the technology in their servers rather than selling silicon-photonics products directly.
"This is only first generation," says Absil. "As it picks up, there will be more incentive to work on a second generation of silicon photonics which will depart from what we know from the early work published by Intel and Luxtera."
The opportunities this next-generation technology will offer are 'quite exciting', says Absil.